SIPI Architect for High-Speed SerDes

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$262,500–$394,000 / yr
Posted
15 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $225k
This role $328k
$159k most similar roles pay here $419k

This role pays more than 96% of similar roles. Most pay $187,850–$261,825 — the shaded band above. At the midpoint, this role pays about $328k versus about $225k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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At a glance

TL;DR · SIPI Architect for High-Speed SerDes

SIPI Architect for High-Speed SerDes works with the SoC development team to define and own the end-to-end signal and power integrity strategy for cutting-edge high-speed SerDes interconnects. The role involves guiding technical direction across cross-functional teams, including circuit design, packaging, system hardware, and validation. Key responsibilities include leading system-level trade-off analyses to optimize performance, power, and cost while overseeing comprehensive modeling, simulation, and silicon correlation. The position requires expertise in 112G/224G SerDes technologies, advanced packaging like 2.5D/3D integration, and co-packaged optics. Candidates must possess skills in link budget analysis, statistical and time-domain simulation, and knowledge of protocols such as Ethernet, PCIe, UAL, and CXL. The role addresses the technical challenge of ensuring robust interconnect performance from silicon to system for large-scale systems like data centers or high-performance computing environments.

What you'll do

  • Define and own the end-to-end signal and power integrity architecture for high-speed SerDes links.
  • Lead system-level trade-off analyses to optimize performance, power, and cost across silicon, package, and system levels.
  • Oversee comprehensive modeling, simulation, and silicon correlation to ensure robust interconnect design.
  • Provide expert guidance on future interconnect technologies and advanced packaging for the company's technology roadmap.
  • Develop and champion next-generation SIPI methodologies and best practices for design and analysis.
  • Drive technical consensus across cross-functional teams including circuit design, packaging, and system hardware.

What we're looking for

  • BS degree and 20+ years of relevant industry experience.
  • MS or PhD in Electrical Engineering or a related field (preferred).
  • Deep expertise in system-level SIPI for high-speed SerDes (112G/224G and beyond) (preferred).
  • Proven experience architecting solutions for interconnects using Ethernet, PCIe, UAL, and CXL (preferred).
  • Expertise in end-to-end channel modeling, link budget analysis, and statistical or time-domain simulation (preferred).
  • In-depth understanding of SerDes TX/RX equalization, clocking, and power delivery trade-offs (preferred).
  • Experience leading cross-functional teams across silicon architecture, circuit design, packaging, and system hardware (preferred).
  • Familiarity with advanced packaging, co-packaged optics, or high-power ASIC thermal co-design (preferred).

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