SIPI Architect for High-Speed SerDes

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Austin, TX
Posted
15 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

How this pay compares to similar roles

Similar $225k
$172k most similar roles pay here $300k

This listing doesn't post a salary. Most similar roles pay $187,850–$262,625.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

Most-posted roles

View all roles at Apple Inc

At a glance

TL;DR · SIPI Architect for High-Speed SerDes

The SIPI Architect for High-Speed SerDes joins the team developing SoCs to define and own the end-to-end signal and power integrity strategy for cutting-edge high-speed SerDes links. This role involves guiding technical direction across cross-functional teams, including circuit design, packaging, system hardware, and validation to ensure robust interconnect performance from silicon to system. The architect will perform system-level trade-off analyses regarding performance, power, and cost while overseeing comprehensive modeling, simulation, and silicon correlation. Key technical requirements include expertise in 112G/224G SerDes technologies, Ethernet, PCIe, UAL, and CXL protocols. The role also involves managing link budget analysis, TX/RX equalization techniques, and co-packaged optics. The work focuses on solving complex interconnect challenges for large-scale systems such as data centers or high-performance computing environments using advanced packaging like 2.5D/3D integration.

What you'll do

  • Define and own the end-to-end signal and power integrity architecture for high-speed SerDes links.
  • Drive technical direction and build consensus across circuit design, packaging, hardware, and validation teams.
  • Lead system-level trade-off analyses to optimize performance, power, and cost across silicon and package levels.
  • Provide expert guidance on future interconnect technologies and advanced packaging for the technology roadmap.
  • Oversee comprehensive modeling, simulation, and silicon correlation to ensure robust interconnect design.
  • Develop and champion next-generation SIPI methodologies and best practices for design and analysis.

What we're looking for

  • BS degree and 10+ years of relevant industry experience.
  • MS or PhD in Electrical Engineering or a related field with 10+ years of experience (preferred).
  • Deep expertise in system-level SIPI for high-speed SerDes (112G/224G and beyond) (preferred).
  • Proven experience architecting solutions for high-performance interconnects using standards such as Ethernet, PCIe, UAL, and CXL (preferred).
  • Expertise in end-to-end channel modeling, link budget analysis, and statistical or time-domain simulation (preferred).
  • In-depth understanding of SerDes TX/RX equalization, clocking, and power delivery trade-offs (preferred).
  • Experience leading cross-functional teams to drive technical consensus across silicon, packaging, and system hardware groups (preferred).
  • Familiarity with advanced packaging, co-packaged optics, and system-level PDN or thermal co-design (preferred).

More like this

Similar roles

SIPI Architect for High-Speed SerDes

Apple Inc

San Francisco, CA 15 days ago $184,700–$324,800
SerDes Power Integrity SIPI Ethernet PCIe UAL CXL Channel Modeling Link Budget Analysis COM Time-Domain Simulation TX/RX Equalization Co-packaged Optics (CPO) 2.5D/3D Integration PDN Thermal Co-design ASIC
10+ yrs exp

SIPI Architect for High-Speed SerDes

Apple Inc

San Francisco, CA 15 days ago $262,500–$394,000
SerDes Power Integrity SIPI Ethernet PCIe UAL CXL Channel Modeling Link Budget Analysis COM Time-domain Simulation TX/RX Equalization Co-packaged Optics (CPO) 2.5D/3D Integration PDN Thermal Co-design ASIC
10+ yrs exp

Principal High-Speed I/O Architect

Arm Holdings

Austin, TX +2 77 days ago $249,900–$338,100
PCIe CXL UA Link SoC Architecture Coherency Protocols Cache Design Memory Systems Heterogeneous Compute Chiplet Connectivity Performance Modeling Firmware System Software
10+ yrs exp Hybrid

Principal High-Speed I/O Architect

Arm Holdings

San Jose, CA +1 165 days ago $262,700–$355,400
PCIe CXL UA Link SoC Architecture Coherency Protocols Cache Design Memory Systems Heterogeneous Compute Chiplet Connectivity Performance Modeling Firmware System Software Physical Design
10+ yrs exp Hybrid

Senior Leader, Electrical Systems Architect

Qualcomm

San Diego, CA 11 days ago $256,600–$385,000
PAM4 SerDes Signal Integrity (SI) Power Integrity (PI) PCB Design Advanced Packaging ADS HFSS CST HSPICE MATLAB Python Cadence Sigrity PowerSI Clarity SystemVerilog Verilog-A IBIS-AMI Ethernet PCIe UALink NVLink
10+ yrs exp