This role pays more than
64%
of similar roles. Most pay
$184,900–$251,000
— the shaded band above.
At the midpoint, this role pays about
$231k
versus about
$218k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
2925 open roles
on FindRole.
Listed pay typically runs
$166,600–$277,600
across 2305 roles with salary data.
Silicon Photonics EPM, Data Center SoC joins the silicon organization to lead Analog, Mixed-Signal, and Silicon Photonics IP programs specifically for data center SoCs. This role involves managing the end-to-end development of high-speed AMS and optical IPs, including SerDes, PLLs, Data Converters, TIAs, drivers, and Silicon Photonics engines from concept through mass production. The candidate will coordinate across teams like IC Design, Optical Packaging, and Reliability to define test structures for electrical and optical testing while managing a multi-disciplinary supply chain involving foundries and OSATs. Key technical areas include advanced packaging technologies such as 2.5D/3D near and co-packaged optics, SiPh process platforms, and high-speed SerDes across cutting-edge nodes. The role addresses the challenge of replacing electrical interconnects with optical I/O to achieve higher bandwidth and energy efficiency in data center infrastructure.
Manage the end-to-end lifecycle of Mixed-Signal and Silicon Photonics IP from concept through mass production.
Orchestrate the development of optical engine modules, fiber integration, and co-packaged optics solutions.
Partner with foundries, OSATs, and component vendors to develop proprietary hardware for data center products.
Define requirements and implementation strategies for advanced electrical and optical test structures.
Act as the central hub connecting IC design, packaging, reliability, and legal teams to meet technical gates.
Synchronize global engineering efforts across multiple international time zones and a distributed photonics ecosystem.
Identify risks within the multi-disciplinary supply chain and develop mitigation strategies for high-priority milestones.
What we're looking for
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field.
10+ years of relevant experience.
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field (preferred).
Hands-on program leadership experience with Silicon Photonics devices and subsystems or optical I/O and co-packaged optics for data center applications (preferred).
Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes (preferred).
Familiarity with optical packaging concepts such as fiber-array attach, active/passive alignment, flip-chip, and thermal/reliability considerations (preferred).
Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale (preferred).