This role pays more than
89%
of similar roles. Most pay
$174,375–$241,750
— the shaded band above.
At the midpoint, this role pays about
$255k
versus about
$208k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
2925 open roles
on FindRole.
Listed pay typically runs
$166,600–$277,600
across 2305 roles with salary data.
Silicon Photonics & Optical Packaging Eng will join the team to lead silicon photonics packaging technology development, focusing on high-volume, low-cost optical interconnect solutions. The role involves developing engine and chiplet packaging, defining assembly baseline processes, and establishing optical coupling designs optimized for performance, reliability, yield, and cost. You will design and model silicon photonic devices, simulate architectures using Lumerical, Zemax, or COMSOL, and prototype integrated packages to correlate simulation with electrical measurements. Key responsibilities include collaborating with cross-functional teams to ensure manufacturable designs and managing relationships with vendors and foundries to move solutions from concept to high-volume manufacturing. The work addresses the technical challenge of developing next-generation optical I/O modules for data center connectivity and short-distance board applications, requiring expertise in fiber assembly, CMOS BEOL wafer scale processing, and flip chip assembly techniques.
Design and model silicon photonic devices and optical interconnects to optimize coupling, thermal, and signal integrity.
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using specialized software tools.
Prototype and characterize integrated photonic packages by correlating simulation results with physical measurements.
Lead the development of optical engine modules, fiber array connectors, and co-packaging optics.
Manage the transition of silicon photonics packaging solutions from initial concept to high-volume manufacturing.
Coordinate with vendors, foundries, and OSAT partners to drive micro-optical component assembly and interface characterization.
Define package bills of materials (BOM) and establish assembly processes optimized for performance, reliability, yield, and cost.
What we're looking for
Bachelor of Science degree and 10+ years of relevant industry experience.
Master's or PhD in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field (preferred).
Strong theoretical background in optics and photonics fundamentals and device/module integration (preferred).
Hands-on experience in packaging and measuring fiber-coupled devices (preferred).
Hands-on experience in optical component design, simulation, qualification, and single/multi-mode fiber assembly using active and passive alignment tools (preferred).
Minimum 5 years of work experience in the related field with an M.S. or Ph.D. (preferred).
Hands-on experience with CMOS BEOL wafer scale processing and flip chip assembly (preferred).
Experience with silicon photonics device laser, modulator, PD, and passive components like Si WG or MUX/DeMUX (preferred).