This role pays more than
71%
of similar roles. Most pay
$184,900–$251,000
— the shaded band above.
At the midpoint, this role pays about
$244k
versus about
$218k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
2925 open roles
on FindRole.
Listed pay typically runs
$166,600–$277,600
across 2305 roles with salary data.
Silicon Photonics EPM, Data Center SoC is a critical role within the silicon organization focused on developing high-speed Analog, Mixed-Signal (AMS), and Silicon Photonics IP for data center SoCs. The Engineering Program Manager will lead the end-to-end development of optical I/O subsystems, including SerDes, PLLs, Data Converters, TIAs, and drivers from concept through mass production. This role involves managing complex programs involving advanced packaging technologies like 2.5D/3D and co-packaged optics while coordinating with cross-functional teams in IC Design, Photonics Design, and manufacturing. The candidate will navigate the technical complexities of silicon photonics platforms to solve bandwidth and energy efficiency challenges for next-generation data center infrastructure. Key requirements include expertise in AMS IP development flows, advanced EDA tools, and experience with components like lasers, modulators, photodetectors, and waveguides across cutting-edge technology nodes.
Manage the end-to-end program lifecycle for Mixed-Signal IP and Silicon Photonics engines from concept through mass production.
Orchestrate the development of optical engine modules, fiber array integration, and co-packaged optics solutions.
Partner with foundries, OSATs, and component vendors to co-develop proprietary hardware for data center products.
Define requirements and implementation strategies for advanced electrical and optical test structures and characterization.
Act as the central hub connecting IC design, packaging, reliability, and legal teams to meet technical gates.
Synchronize global engineering efforts and deliverables across a geographically distributed photonics ecosystem.
Identify risks within the multi-disciplinary supply chain and develop mitigation strategies for high-priority milestones.
What we're looking for
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field.
10+ years of relevant experience.
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field (preferred).
Hands-on program leadership experience with Silicon Photonics devices and subsystems or optical I/O and co-packaged optics for data center applications (preferred).
Extensive experience with AMS IPs supporting optical interconnects including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs (preferred).
Familiarity with optical packaging concepts such as fiber-array attach, active/passive alignment, flip-chip, and thermal/reliability considerations (preferred).
Experience with adjacent optical technologies like uLED or uVCSEL is a plus.