Signal and Power Integrity Engineer

Microsoft

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
—
Salary
$102,100–$202,200 / yr
Posted
2 days ago
Freshness
Confirmed live today
Closes
Apr 6, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $204k
This role $152k
$85k $259k
below market most similar roles pay here above market

This role pays less than 84% of similar roles. Most pay $166,125–$241,750 — the blue band above. At the midpoint, this role pays about $152k versus about $204k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 648 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 624 roles with salary data.

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At a glance

TL;DR · Signal and Power Integrity Engineer

The Signal and Power Integrity Engineer joins the Silicon Manufacturing and Product Engineering team to develop advanced power delivery and signaling solutions for High Performance Computing silicon designs. This role focuses on compute and AI SoCs and platforms, where the engineer will implement end-to-end power delivery and signal integrity strategies from silicon to package, linking to platform and system levels. Key responsibilities include designing, modeling, and simulating SI and PI components such as IP design, voltage regulators, motherboards, CPU packages, and decoupling capacitors. The engineer will perform DC, AC, and transient simulations to provide noise and impedance profiles while validating I/O performance. Required expertise includes electrical engineering principles, system design, and modeling to support chiplet architecture with advanced packaging and silicon nodes for data center processors.

What you'll do

  • Implement end-to-end power delivery and signal integrity strategies from silicon to package and cloud systems.
  • Deliver SIPI solutions that meet high-performance computing demands across the entire system.
  • Drive power and signal integrity solutions for chiplet architectures using advanced packaging and silicon nodes.
  • Design, model, and simulate SI and PI components including voltage regulators, motherboards, and decoupling capacitors.
  • Perform DC, AC, and transient simulations to provide noise profiles and validate I/O performance.
  • Develop system models based on current and anticipated feature needs and technical trade-offs.
  • Execute architecture solutions across multiple product lines by leveraging industry best practices and lessons learned.

What we're looking for

  • Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 1+ year of technical engineering experience.
  • Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 2+ years technical engineering experience.
  • Equivalent experience to the degree and years of experience requirements.
  • Ability to pass the Microsoft Cloud Background Check.
  • Must provide proof of citizenship, US residency, or other protected status for export control eligibility.
  • MS degree with 3+ years of experience in silicon/package/system signal integrity and power delivery (preferred).
  • BSEE degree with 5+ years of experience in silicon/package/system signal integrity and power delivery (preferred).
  • Good foundation in SIPI, system design, and IP design with 5+ years of experience in design and electrical modeling (preferred).

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