below marketmost similar roles pay hereabove market
This role pays less than
83%
of similar roles. Most pay
$163,125–$241,750
— the blue band above.
At the midpoint, this role pays about
$152k
versus about
$202k
for comparable roles.
Based on 240 similar postings.
Employer
About Microsoft
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has
648 open roles
on FindRole.
Listed pay typically runs
$119,800–$234,700
across 624 roles with salary data.
JOB TITLE: Senior Signal and Power Integrity Engineer
The Senior Signal and Power Integrity Engineer joins the Silicon Manufacturing and Product Engineering team to develop advanced power delivery and signaling solutions for High Performance Computing silicon designs. This role involves implementing end-to-end strategies from silicon to package, linking to platform and system levels. Key responsibilities include designing, modeling, and simulating SI and PI for data center processors, including IP design, voltage regulators, and decoupling capacitor solutions. The engineer performs DC, AC, and transient simulations to provide noise and impedance profiles while validating I/O performance. Required skills include expertise in signal and power integrity, system design, and electrical modeling. The work addresses technical challenges in chiplet architecture, advanced packaging, and advanced silicon nodes to optimize performance for compute and AI SoCs.
Implement end-to-end power delivery and signal integrity design strategies from silicon to package and cloud.
Deliver SIPI solutions that meet high-performance computing demands across the entire system.
Drive power and signal integrity solutions for chiplet architecture using advanced packaging and silicon nodes.
Design, model, and simulate SI and PI components including voltage regulators, motherboards, and decoupling capacitors.
Perform DC, AC, and transient simulations to provide noise and impedance profiles for the power delivery path.
Execute architecture solutions across product lines by leveraging cross-functional expertise and industry best practices.
Develop system models based on current and anticipated feature needs and technical trade-offs.
What we're looking for
Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 1+ year of technical engineering experience.
Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 2+ years of technical engineering experience.
Equivalent experience to the degree and years of experience requirements.
Expert in Signal and Power Integrity, system design, and IP design with at least 5 years of experience in design and electrical modeling (preferred).
Working knowledge of end-to-end system SIPI Design and Architecture (preferred).
Experience with high-speed signal design and/or power integrity modeling for HPC products (preferred).
Experience with Foundry Silicon, OSAT, and Substrate technologies (preferred).
Ability to pass Microsoft Cloud Background Check and provide proof of citizenship or US residency for export control regulations.
Power Integrity
PDN Modeling
Voltage Regulator Design
Python
EM Simulation
RF Circuit Design
VNA
Spectrum Analyzer
Real-time Scope
Transmission Line Theory
AI/ML
Signal Integrity
Package Design
Power Integrity
Power Delivery Network (PDN)
Signal Integrity
Analog Circuit Design
Python
EM Simulation
Voltage Regulator Design
VNA
Spectrum Analyzer
Real-time Scope
Transmission Line Theory
AI/ML
Package Design
Power Integrity
Signal Integrity
PDN Modeling
Voltage Regulator Design
Python
EM Simulation
VNA
Spectrum Analyzer
Real-time Scope
Analog Circuit Design
Power Electronics
Transmission Line Theory
AI/ML
Package Design
Power Integrity
Signal Integrity
PDN Modeling
Python
AI/ML
EM Simulation
Voltage Regulator Design
VNA
Spectrum Analyzer
Real-time Scope
Transmission Line Theory
Package Design
Low-power Design
Model to Hardware Correlation