Principal Signal and Power Integrity Engineer

Microsoft

Confirmed live today Low trust
Hybrid

Quick summary

Work type
Hybrid
Location
—
Salary
$142,800–$274,800 / yr
Posted
146 days ago
Freshness
Confirmed live today
Closes
Nov 29, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $196k
This role $209k
$127k $291k
below market most similar roles pay here above market

This role pays more than 59% of similar roles. Most pay $165,000–$226,694 — the blue band above. At the midpoint, this role pays about $209k versus about $196k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 694 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 651 roles with salary data.

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At a glance

TL;DR · Principal Signal and Power Integrity Engineer

The Principal Signal and Power Integrity Engineer joins the Signal and Power Integrity Team within the Compute Silicon & Manufacturing Engineering organization. This role focuses on the design, development, and manufacturing of Microsoft's custom computer chips, specifically for compute and AI SoCs and platforms. The engineer will implement end-to-end power delivery strategies from silicon to package, ensuring high-performance computing demands are met. Key responsibilities include designing, modeling, and simulating power integrity for data center processors, including voltage regulators, motherboards, and decoupling capacitor solutions. The position requires performing DC, AC, and transient simulations to validate I/O performance. Essential skills include expertise in advanced packaging technologies, foundry silicon, OSAT, and substrate technologies to solve complex power delivery and signal integrity challenges across chiplet architectures and advanced silicon nodes.

What you'll do

  • Implement end-to-end power delivery design strategies from silicon to package, platform, and cloud systems.
  • Deliver Signal and Power Integrity (SIPI) solutions that meet high-performance computing demands across the entire system.
  • Drive future power delivery solutions for chiplet architectures using advanced packaging and silicon nodes.
  • Design, model, and simulate power integrity for data center processors, including voltage regulators and decoupling capacitors.
  • Perform DC, AC, and transient simulations to provide noise and impedance profiles for the entire power delivery path.
  • Execute architecture solutions across multiple product lines by leveraging cross-functional expertise and industry practices.
  • Develop system models based on current and anticipated feature needs and technical trade-offs.

What we're looking for

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of technical engineering experience.
  • Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of technical engineering experience.
  • Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 8+ years of technical engineering experience.
  • Experience in power integrity modeling for HPC products (preferred).
  • Experience with Foundry Silicon, OSAT, and Substrate technologies (preferred).
  • Experience in silicon/package/system power integrity/delivery with 7+ years of experience (preferred).
  • Ability to meet Microsoft, customer, and/or government security screening requirements.
  • Must provide proof of citizenship, US residency, or other protected status for export control access.

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