Principal Signal and Power Integrity Engineer

What you'll do

• Implement end-to-end power delivery design strategies from silicon through package to platform and system levels.
• Deliver signal and power integrity solutions that meet high-performance computing demands across the entire system.
• Develop future power delivery solutions for chiplet architectures using advanced packaging and silicon nodes.
• Design, model, and simulate power integrity components including voltage regulators, motherboards, and decoupling capacitors.
• Perform DC, AC, and transient simulations to provide noise and impedance profiles for the power delivery path.
• Conduct link and electrical simulations to validate I/O performance from platform to silicon.
• Drive engineering system design decisions by balancing trade-offs between internal and external stakeholder requirements.
• Execute architecture solutions across multiple product lines by leveraging cross-functional expertise and industry practices.

What we're looking for

• A Doctorate in Electrical Engineering, Computer Engineering, or Computer Science with 3+ years of technical engineering experience.
• A Master's degree in Electrical Engineering, Computer Engineering, or Computer Science with 6+ years of technical engineering experience.
• A Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Science with 8+ years of technical engineering experience.
• Experience in power integrity modeling for high-performance computing (HPC) products and advanced packaging technologies.
• Knowledge of foundry silicon, OSAT, substrate, and board technologies to drive development across the platform.
• Expertise in end-to-end system signal and power integrity (SIPI) design and architecture.
• Ability to pass a Microsoft Cloud Background Check every two years.
• Must provide proof of citizenship or protected status to access export-controlled information.