Senior Signal Integrity Engineer, LPU Packaging

Nvidia

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Santa Clara, CA
Salary
$168,000–$264,500 / yr
Employment
Full-time
Posted
55 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $192k
This role $216k
$136k $278k
below market most similar roles pay here above market

This role pays more than 75% of similar roles. Most pay $168,250–$216,562 — the blue band above. At the midpoint, this role pays about $216k versus about $192k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 1623 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 1110 roles with salary data.

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At a glance

TL;DR · Senior Signal Integrity Engineer, LPU Packaging

The Senior Signal Integrity Engineer joins the Packaging and Systems team to drive high-speed SerDes channel design, simulation, and correlation for next-generation advanced packages and data center platforms. The role involves leading signal integrity analysis across die, package, board, connector, socket, and cable interfaces. Key responsibilities include developing simulation flows for 2.5D, 3D, and multi-die integration, optimizing chip-package-board co-simulation methodologies, and performing pre-layout and post-layout analysis. The candidate will use tools such as Ansys HFSS, SIwave, Cadence Sigrity, ADS, and HSPICE to model channel loss, crosstalk, and return path behavior. Technical requirements include expertise in electromagnetics, transmission line theory, NRZ and PAM4 signaling, and correlation with lab measurements using TDR, VNA, and oscilloscopes to solve complex interconnect problems for HPC and AI applications.

What you'll do

  • Lead signal integrity design and analysis for high-speed SerDes channels across die, package, board, and connector interfaces.
  • Develop and execute simulation flows for 2.5D, 3D, and multi-die integration focusing on channel loss and crosstalk.
  • Build and optimize chip-package-board co-simulation methodologies for next-generation HPC and data center systems.
  • Perform pre-layout and post-layout signal integrity analysis to ensure electrical performance targets are met.
  • Correlate simulation results with lab measurements using TDR, VNA, and oscilloscope techniques to improve model accuracy.
  • Support interface bring-up, debug, and margin analysis to translate correlation learnings into reusable design flows.
  • Automate analysis, data processing, and visualization to scale signal integrity methodology across multiple programs.

What we're looking for

  • BS, MS, or PhD in Electrical Engineering or equivalent experience.
  • 8+ years of industry experience in signal integrity, high-speed interconnect design, or related hardware development roles.
  • Strong background in electromagnetics, transmission line theory, channel modeling, and high-speed serial link behavior.
  • Proven experience with high-speed SerDes design and analysis for advanced packaging and/or large-scale system applications.
  • Hands-on experience with industry-standard SI tools such as Ansys HFSS, SIwave, Cadence Sigrity, ADS, HSPICE, or equivalent.
  • Experience building and using channel models, S-parameters, IBIS-AMI based flows, and time/frequency-domain analysis techniques.
  • Strong understanding of NRZ and PAM4 signaling, equalization techniques, jitter/noise mechanisms, and end-to-end channel budgets.
  • Experience with simulation-to-measurement correlation and lab-based model validation using VNA, TDR, and high-speed scope measurements.

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