Senior Signal Integrity Engineer, Cryogenic Interconnects

What you'll do

• Develop accurate 3D EM models for PCB and interconnect structures using HFSS.
• Define high-speed constraints and SI specifications across RF, materials, and thermal domains.
• Design next-generation cryogenic interconnect solutions for ultra-high-speed communication.
• Perform lab characterization and validation using network analyzers and other measurement tools.
• Correlate simulation results with hardware measurements to improve modeling accuracy.
• Analyze interconnect behavior across PCB, package, and system domains.

What we're looking for

• MS/PhD in Electrical Engineering or equivalent experience.
• 5+ years of experience.
• Strong experience in signal integrity modeling and simulation using HFSS or similar EM tools.
• Deep understanding of high-frequency/broadband design and multi-layer PCB design.
• Knowledge of PCB materials and their electrical and physical properties.
• Experience with lab measurements using network analyzers and high-speed characterization.
• Background in cryogenic technologies or a strong interest in developing expertise in this area.
• Experience in extreme environments or low-loss/ultra-high-speed interconnects (preferred).