This role pays more than
56%
of similar roles. Most pay
$162,050–$217,981
— the shaded band above.
At the midpoint, this role pays about
$190k
versus about
$190k
for comparable roles.
Based on 240 similar postings.
Employer
About Arm Holdings
Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.
Arm Holdings currently has
105 open roles
on FindRole.
Listed pay typically runs
$209,100–$282,900
across 105 roles with salary data.
As a Senior Package Layout Engineer within the System-in-Package team, you will contribute to implementing next-generation SoCs for the IoT, Automotive, and Compute spaces. You will be responsible for the design, development, and verification of package designs while navigating loosely defined problems and adapting to frequent design changes. Your daily work involves developing IC Package Layouts for high speed signal and high power devices, conducting feasibility studies regarding size, cost, and system performance, and implementing routing, stack-up creation, reference planes, and power distribution. You will utilize the Cadence APD or SiP tool suite and Allegro toolsets to execute these tasks. The role requires expertise in 2.5D and 3D package systems with specific SI/PI requirements. You will also provide guidance on methodologies to improve team efficiency and drive standardization across the department.
Cadence APD
PCB Layout
HDI Design
Virtuoso
Calibre
Valor
Constraint Manager
Signal Integrity
IC Substrates
Wire Bond
Flip Chip
Package Routing
Power Distribution
CAD Library Databases
High-Speed Design