RF Analog Design Mixed-Signal Engineering Internship

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CATempe, AZIrvine, CASanta Clara, CAAustin, TXBoulder, COBoxborough, MABridgewater, NJChandler, AZNew York, NYLouisville, KYRaleigh, NCSeattle, WA
Employment
Intern
Posted
3 days ago
Freshness
Confirmed live yesterday
Closes
Mar 17, 2027

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Salary context

How this pay compares to similar roles

Similar $182k
$133k most similar roles pay here $228k

This listing doesn't post a salary. Most similar roles pay $145,000–$219,237.

Based on 240 similar postings.

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About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 615 open roles on FindRole.

Listed pay typically runs $155,400–$232,600 across 593 roles with salary data.

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At a glance

TL;DR · RF Analog Design Mixed-Signal Engineering Internship

RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027 is an internship opportunity where candidates contribute to cutting-edge projects in 5G/6G mmWave, RF system design, transceiver performance optimization, and RFIC/Analog IC design. Depending on the assigned track, the role involves developing technologies such as power amplifiers, WLAN/Bluetooth LNAs, ADC/DAC, and high-speed interfaces like PCIe or USB. The work addresses complex technical challenges in signal processing, integration, and SoC implementation. Candidates will utilize tools and languages including Cadence, HFSS, MATLAB, Perl, Verilog, SystemVerilog, Python, Tcl, and Shell. Core competencies required include microwave theory, electromagnetics, RTL coding, static timing analysis, and circuit layout. The role focuses on solving critical problems in wireless connectivity, power delivery networks, and high-speed communication systems to establish new standards for mobile and interconnected technology.

What you'll do

  • Perform RF system design, transceiver performance analysis, and optimization for 5G/6G mmWave technologies.
  • Design and analyze RFIC, Analog IC, power amplifiers, and high-speed interface systems.
  • Conduct signal processing integration and RF microwave design for wireless communication components.
  • Execute mixed-signal IP architecture definition, implementation, and SoC integration for ADC/DAC and PLL.
  • Perform RTL coding, lint checks, and static timing analysis for high-speed critical paths.
  • Analyze power delivery networks (PDN) and signal integrity for printed circuit board designs.
  • Utilize tools like Cadence, HFSS, MATLAB, and Python to model and simulate electrical systems.

What we're looking for

  • Must be currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
  • Must be available for 11–14 weeks during Summer 2027 (May–September).
  • Expected graduation date must be November 2027 or later.
  • Enrollment in a Master’s or PhD degree program is preferred.
  • Candidates with an anticipated graduation date between November 2027 and June 2028 are preferred.
  • Experience in RF, microwave theory, antenna theory, and Analog or RFIC design (preferred).
  • Proficiency in programming languages such as Perl, MATLAB, Cadence, HFSS, Verilog, Shell, Python, Tcl, or SystemVerilog (preferred).
  • Export Control Notice.

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