Research Scientist, RF/Mixed-Signal Packaging and Module Design

What you'll do

• Develop high-performance RF and mixed-signal single-chip and multi-chip modules (MCMs) for quantum computing applications.
• Design packaging solutions that support RFICs, high-speed digital interfaces, and high-density interconnects.
• Perform EM simulations, package-IC co-simulations, and signal/power integrity (SI/PI) analyses.
• Utilize various substrate technologies including organic laminates and Si-based interposers for design projects.
• Execute all stages of the design process from concept and architecture definition to bring up and testing.
• Conduct experimental characterization and hands-on laboratory testing of RF, analog, and mixed-signal packaging solutions.

What we're looking for

• Doctorate Degree (preferred).
• Strong background in RF/microwave engineering.
• Familiarity with state-of-the-art packaging technologies and experience with tools like HFSS, ADS, or Cadence Allegro.
• At least 2 years of experience in RF/Mixed-Signal Package Design including physical design, EM simulation, and SI/PI.
• At least 2 years of experience in module implementation for RF, analog, and mixed-signal packaging with experimental characterization.
• Experience with high-density digital interconnects, RF/digital IC design, or programming (preferred).
• Proven research accomplishments, communication skills, and background in quantum computing or communication theory (preferred).