Research Scientist – RF/Mixed-Signal Packaging and Module Design joins the IBM Quantum team to develop advanced, high-performance RF and mixed-signal single-chip and multi-chip modules for exploratory applications. The role involves designing packages for RFICs, high-speed digital interfaces, and high-density interconnects using organic laminates or Si-based interposers. Key responsibilities include performing EM simulation, package-IC co-simulation, and signal integrity and power integrity analysis. The successful candidate will collaborate with IC and system designers from concept through bring-up and testing, requiring hands-on lab skills. Required expertise includes RF/microwave engineering, state-of-the-art packaging technologies, and proficiency with tools like HFSS, ADS, and Cadence Allegro. This work addresses communication and computation challenges, specifically creating CMOS-based electronics for quantum computing applications.
What does a Research Scientist earn?
Median $216250 from 45 postings across 16 companies.
C
C++
Python
Automated Test Equipment (ATE)
Mixed Signal Testing
SERDES
Wafer Sort
Wafer Probe
Probe Card Design
Semiconductor Packaging
Parametric Test Design