Process and Integration Engineer, Optoelectronics

What you'll do

• Lead the development and scaling of complex multilayer coatings using Ion Beam Sputtering.
• Design and execute experiments to improve manufacturing efficiency and optimize batch processes.
• Serve as the technical lead for facet coating, wafer scribing, and automated visual inspection.
• Manage equipment lifecycles including defining requirements, qualifying upgrades, and tool acquisitions.
• Implement process control plans using SPC, FMEA, and OCAP to monitor production quality.
• Conduct root cause analyses and implement CAPA to mitigate defects and process excursions.
• Manage subcontractor performance across regions and maintain standard operating procedures.
• Establish KPIs and dashboards to monitor daily performance, cycle times, and process health.

What we're looking for

• Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.
• Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering (preferred).
• Minimum of 3 years of experience in semiconductor manufacturing.
• At least 1 year of hands-on experience in thin-film deposition, specifically for optoelectronic devices.
• Solid understanding of vacuum physics, deposition techniques (IBS, ALD), and dielectric coating materials.
• Proficiency with SPC, DOE, FMEA, DMAIC, and tools such as JMP, SQL, and Tableau.
• Experience with automated bar-handling, wafer scribing, Pick-and-Place, AVI tools, and Burn-in.
• Proven knowledge and practical application of Lean manufacturing methodologies (preferred).