Process Engineer 5

Lam Research

Confirmed live today High trust

Hybrid

Quick summary

Work type: Hybrid
Location: Fremont, CA
Salary: $125,000–$270,000 / yr
Posted: 6 days ago
Freshness: Confirmed live today
Closes: Apr 21, 2027
Nearby: 99+ roles within 25 mi

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $209k

This role $198k

$108k $287k

below market most similar roles pay here above market

This role pays less than 53% of similar roles. Most pay $172,000–$246,150 — the blue band above. At the midpoint, this role pays about $198k versus about $209k for comparable roles.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 138 open roles on FindRole.

Listed pay typically runs $122,000–$265,500 across 84 roles with salary data.

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At a glance

TL;DR · Process Engineer 5

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The Process Engineer 5 joins the Reliant Etch Technology team within the Customer Support Business Group to develop advanced etch solutions for specialty semiconductor and advanced packaging applications. This role involves designing, executing, and analyzing experiments to optimize processes, improve yield, and establish robust process windows. You will define hardware requirements, analyze experimental data, and present results from customer demonstrations to solve complex manufacturing challenges. Key technical requirements include expertise in plasma physics, Reactive Ion Etching, Inductively Coupled Plasma, and Capacitively Coupled Plasma. You will utilize Design of Experiments and statistical analysis to support technologies like 3D integration, HBM, and plasma dicing. The work focuses on bringing next-generation semiconductor and advanced packaging solutions from initial concept to full production implementation for high-performance computing.

Skills

Semiconductor Manufacturing Plasma Physics Reactive Ion Etching (RIE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Design of Experiments (DOE) Statistical Analysis Advanced Packaging 3D Integration HBM TSV Materials Characterization Plasma Dicing Deposition Surface Modification

What you'll do

Develop and optimize advanced etch processes for specialty semiconductor and advanced packaging applications.
Design, execute, and analyze experiments to improve process performance, yield, and productivity.
Define process and hardware requirements to meet evolving technology and customer needs.
Analyze experimental data to establish robust process windows and solve complex technical challenges.
Plan, execute, and present results from customer demonstrations and technology evaluations.
Contribute to next-generation product development and technology releases.
Drive the introduction and adoption of new manufacturing technologies at customer sites worldwide.

What we're looking for

Bachelor's degree with 12+ years of related industry experience; or
Master's degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field with 8+ years of industry experience; or
PhD in a relevant technical discipline with 5+ years of industry experience; or
An equivalent combination of education and professional experience.
Strong experience in semiconductor process development, including etch, deposition, dielectric, conductor, and metal film technologies (preferred).
Deep understanding of advanced packaging technologies and integration schemes (preferred).
Hands-on experience with frame-form plasma dicing technologies, wafer handling systems, and plasma etch development (preferred).
Strong background in plasma physics and processing technologies like RIE, ICP, and CCP (preferred).

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