Process Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$184,700–$324,800 / yr
Posted
49 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $169k
This role $255k
$105k $348k
below market most similar roles pay here above market

This role pays more than 95% of similar roles. Most pay $137,750–$199,724 — the blue band above. At the midpoint, this role pays about $255k versus about $169k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3498 open roles on FindRole.

Listed pay typically runs $174,200–$277,600 across 2693 roles with salary data.

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At a glance

TL;DR · Process Engineer

JOB TITLE: Process Engineer The ATG Sensing Group is seeking a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. This role involves owning process development for New Product Introduction, architecting concepts, and defining process flows to ensure successful high-volume manufacturing with external OSAT partners. You will manage process equipment definition, material selection, and flow design while collaborating with internal design and reliability teams. Key responsibilities include developing package processes from proof-of-concept to production, using FMEA for issue identification, and integrating simulations to validate design impacts. Required expertise includes semiconductor sensor packaging, wafer thinning, dicing, die attach, wirebonding, and encapsulation. You must demonstrate proficiency in failure analysis, DOE vs. Hypothesis tools, and leveraging AI to improve project efficiency within complex multi-disciplinary development programs.

What you'll do

  • Define process equipment, material selection, and process flows for module packaging.
  • Develop new package process concepts from proof-of-concept to full production implementation.
  • Evaluate the impact of module packaging materials and processes on system integration.
  • Use simulations to validate design impacts before initiating process development.
  • Identify design and process issues using Failure Mode and Effects Analysis (FMEA).
  • Hand off completed projects to the operations team with clearly defined goals and deliverables.
  • Manage communication channels with module integrators and key technical suppliers.
  • Leverage AI tools to improve overall project efficiency and process development.

What we're looking for

  • BS degree in a relevant field.
  • 10+ years of relevant industry experience.
  • Proven track record of shipping products with 3rd party manufacturing partners.
  • Deep technical expertise in assembly processes and semiconductor packaging technologies (preferred).
  • Strong materials science and failure analysis knowledge related to assembly chip-packaging interactions (preferred).
  • Expert-level knowledge in wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, and wafer level packaging (preferred).
  • Experience using simulations to guide process setup and AI to support process development (preferred).
  • Strong interpersonal, team-building, and communication skills (preferred).

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