This role pays more than
96%
of similar roles. Most pay
$130,882–$187,592
— the shaded band above.
At the midpoint, this role pays about
$255k
versus about
$159k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
2305 open roles
on FindRole.
Listed pay typically runs
$175,000–$280,000
across 1873 roles with salary data.
The Process Engineer joins the ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. This role involves owning process development for New Product Introduction, where the individual will architect new concepts, define process flows, and manage material selection to ensure successful high-volume manufacturing with external OSAT partners. The position requires navigating the intersection of design, materials science, and manufacturing to solve complex integration challenges. Key responsibilities include developing package processes from proof-of-concept to production, performing FMEA, and utilizing simulations for validation. Required expertise includes semiconductor packaging technologies such as wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, and transfer molding. The role also leverages AI to improve project efficiency while addressing specific challenges in capacitive sensing module packaging and cosmetic packaging.
What does a Process Engineer earn?
Median $167500 from 32 postings across 6 companies.
Define process equipment, select materials, and design process flows for module packaging.
Develop new package process concepts from proof-of-concept stages to full production implementation.
Evaluate the impact of packaging processes and materials on system integration.
Use FMEA to identify design and process issues with reliability and product design teams.
Integrate simulations to validate the impact of designs before starting process development.
Manage communication channels and consolidate major issue lists for internal and external partners.
Hand off projects from the engineering phase to operations with clearly defined goals.
Utilize AI tools to improve overall project efficiency during development.
What we're looking for
Bachelor of Science degree and 10+ years of relevant industry experience.
Proven track record of shipping products with third-party manufacturing partners (OSAT).
Strong materials science and failure analysis knowledge regarding assembly chip-packaging interactions and reliability failures (preferred).
Expert-level knowledge in assembly steps including wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, and wafer level packaging (preferred).
Working level knowledge in wafer bumping, RDL, and TSV (preferred).
Experience using simulation to guide process setup (preferred).
Experience using AI to support process development (preferred).
Experience in capacitive sensing module packaging or customer facing cosmetic packaging (preferred).