Process Engineer 5

What you'll do

• Conduct plasma etch process research and development for RIE and patterning applications.
• Develop and optimize etch processes for advanced patterning schemes like EUV and multi-patterning.
• Characterize and improve etch performance metrics including profile, selectivity, and CD uniformity.
• Analyze process and metrology data from CD-SEM and TEM to establish process specifications.
• Partner with lithography and deposition teams to align on patterning roadmaps and requirements.
• Lead and provide technical guidance to process technicians during execution activities.
• Drive the adoption of new etch and patterning technologies at customer sites.

What we're looking for

• Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or related field with 8+ years of experience.
• PhD in Materials Science, Chemical Engineering, Chemistry, Physics, or related field with 5+ years of experience.
• Equivalent professional experience to the degree and years of experience requirements.
• In-depth background in plasma etch, including RIE and ALE, on ICP and/or CCP systems (preferred).
• Hands-on experience with patterning processes such as EUV, 193i, multi-patterning, and high-aspect-ratio etch (preferred).
• Understanding of plasma physics, plasma-surface interactions, and their effects on etch rate and CD control (preferred).
• Experience with etch and patterning metrology, characterization, and failure analysis (preferred).
• Proficiency in MATLAB, Python, statistical tools like JMP or Minitab, and DOE/SPC methodologies (preferred).