Principal Thermal Engineer

Oracle

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Quick summary

Work type
On-site
Location
Houston, TXNashville, TN
Salary
$114,600–$234,600 / yr
Posted
51 days ago
Freshness
Confirmed live yesterday

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $198k
This role $175k
$98k most similar roles pay here $266k

This role pays less than 63% of similar roles. Most pay $170,000–$225,125 — the shaded band above. At the midpoint, this role pays about $175k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Oracle

Oracle Corporation is a leading multinational technology company specializing in database software, cloud computing, and enterprise software.

Oracle currently has 781 open roles on FindRole.

Listed pay typically runs $102,300–$209,500 across 713 roles with salary data.

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At a glance

TL;DR · Principal Thermal Engineer

As a Principal Thermal Engineer, you will serve as the technical lead for direct-to-chip liquid cooling systems, managing deployment and manufacturing with external partners. You will be responsible for developing technical specifications, overseeing the qualification and mass production of cooling solutions, and ensuring adherence to quality and safety standards. Your daily work involves validating engineering designs across mechanical, fluid, thermal, and electrical interfaces while auditing supplier processes for compliance. The role requires expertise in cold plate systems, coolant chemistries, and scaling technologies from proof-of-concept to production. You will utilize knowledge of ASHRAE, OCP, and RoHS standards to solve complex thermal management challenges for high-performance computing and data centers. Essential skills include experience in supplier development, technical troubleshooting, and the ability to translate complex information into actionable guidance for manufacturing partners.

What you'll do

  • Lead the deployment and management of direct-to-chip liquid cooling technology with external manufacturing partners.
  • Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
  • Oversee the qualification, integration, and mass production of systems at external sites to ensure quality and safety standards.
  • Resolve joint problems regarding yield, performance, and manufacturing challenges related to liquid cooling technologies.
  • Review and validate engineering designs against mechanical, fluid, thermal, and electrical requirements.
  • Audit supplier manufacturing processes for compliance with company regulations and industry standards.
  • Improve cooling designs based on manufacturing feedback and field data.
  • Create and maintain technical documentation including test plans, reports, and process control documents.

What we're looking for

  • Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
  • 6 to 10+ years of experience as a professional in the field.
  • 5+ years of experience in thermal systems engineering, preferably with liquid cooling for high-performance computing or data centers.
  • Experience with cold plate cooling systems and coolant chemistries.
  • Hands-on experience with manufacturing processes, supplier management, and technology transfer from lab to mass production.
  • Familiarity with industry standards such as ASHRAE, OCP, and RoHS for data center cooling.
  • Proven ability to perform technical troubleshooting, process audits, and design validation.
  • Ability to communicate complex technical information clearly in English.

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