Thermal Engineer

Amd

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$166,400–$249,600 / yr
Posted
42 days ago
Freshness
Confirmed live yesterday
Closes
Jul 31, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $174k
This role $208k
$116k most similar roles pay here $264k

This role pays more than 75% of similar roles. Most pay $138,987–$208,425 — the shaded band above. At the midpoint, this role pays about $208k versus about $174k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 367 open roles on FindRole.

Listed pay typically runs $166,400–$249,600 across 367 roles with salary data.

Most-posted roles

View all roles at Amd

At a glance

TL;DR · Thermal Engineer

The Thermal Engineer supports the thermal design, modeling, characterization, and validation of next-generation SoC, FPGA, ASIC, and high-performance computing products. Working with cross-functional teams, the engineer performs die, package, board, and system-level simulations to evaluate performance and develop cooling solutions for air-cooled and liquid-cooled systems. Key responsibilities include executing characterization plans, correlating test data with simulation models, conducting back-of-the-envelope calculations, and providing recommendations during design reviews. The role requires expertise in heat transfer fundamentals, CFD tools like Ansys Icepak or FloTHERM, and scripting languages such as Python or MATLAB. Candidates should possess experience with semiconductor packaging, high-power electronics, and data center hardware. This position addresses critical thermal management challenges for advanced computing products while ensuring reliability and manufacturability through rigorous analysis of power maps, hotspot identification, and technical documentation.

What you'll do

  • Perform die, package, board, and system-level thermal simulations to evaluate performance and support cooling solutions.
  • Develop and execute thermal characterization and validation plans for hardware platforms.
  • Analyze thermal test data and correlate measurements with simulation models to improve accuracy.
  • Design and optimize air-cooled and liquid-cooled thermal solutions for high-performance computing products.
  • Conduct thermal analysis and back-of-the-envelope calculations to guide design decisions and assess tradeoffs.
  • Participate in thermal design reviews to provide recommendations on performance, reliability, and manufacturability.
  • Support customer technical engagements by participating in meetings, design reviews, and issue resolution activities.
  • Research thermal management materials and cooling technologies to support future product development.

What we're looking for

  • Master's degree or PhD in Mechanical Engineering, Aerospace Engineering, or a related engineering discipline.
  • Experience in thermal analysis, modeling, characterization, and testing of electronic systems, semiconductor packages, or computing hardware.
  • Proficiency in CFD and thermal simulation tools such as Ansys Icepak, AEDT, FloTHERM, or equivalent.
  • Strong understanding of heat transfer fundamentals including conduction, convection, and radiation.
  • Experience with thermal validation and laboratory testing techniques using thermocouples, data acquisition systems, and airflow measurements.
  • Ability to perform first-order analytical calculations and engineering estimates to support design decisions.
  • Experience analyzing large datasets and generating insights using Python, MATLAB, or similar scripting languages.
  • Familiarity with CAD tools such as SolidWorks, Creo, or equivalent mechanical design software.

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