Senior Thermal Systems Engineer

Flex (Flextronics)

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Littleton, MA
Salary
$126,500–$173,900 / yr
Posted
81 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $174k
This role $150k
$117k most similar roles pay here $212k

This role pays less than 70% of similar roles. Most pay $144,300–$202,887 — the shaded band above. At the midpoint, this role pays about $150k versus about $174k for comparable roles.

Based on 240 similar postings.

Employer

About Flex (Flextronics)

Flex (formerly Flextronics) is a global technology, supply chain, and manufacturing solutions provider helping companies design, build, and deliver products across industries. Industry: Electronics Manufacturing Services

Flex (Flextronics) currently has 29 open roles on FindRole.

Listed pay typically runs $118,300–$162,600 across 15 roles with salary data.

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View all roles at Flex (Flextronics)

At a glance

TL;DR · Senior Thermal Systems Engineer

Sr. Thermal Systems Engineer The Sr. Thermal Systems Engineer joins the engineering team to lead the end-to-end architecture, analysis, validation, and deployment of direct-to-chip cooling systems for high-TDP CPUs, GPUs, and accelerators. This role involves defining system-level thermal requirements, performing fluid dynamics and heat transfer modeling using tools like FloEFD, Icepak, MacroFlow, ANSYS Fluent, or COMSOL, and designing liquid cooling subsystems including cold plates, manifolds, and pumps. The engineer will manage the product lifecycle from prototypes to mass production while collaborating with cross-functional teams on mechanical stack-up, corrosion mitigation, and manufacturing processes. Key technical requirements include expertise in CFD, thermal metrology, and lab instrumentation such as flow meters and pressure transducers. Candidates should possess proficiency in Python or LabVIEW for test automation and have experience in the high-performance computing and data center sectors.

What you'll do

  • Own the end-to-end architecture, analysis, validation, and deployment of direct-to-chip cooling systems for high-TDP components.
  • Define system-level thermal requirements including TDP range, coolant temperature, flow rate, pressure drop, and power budgets.
  • Build and validate 1D/3D thermal models using CFD tools to analyze performance for cold plates, manifolds, and pumps.
  • Design liquid cooling subsystems including CDUs, hoses, quick-disconnects, reservoirs, and sensors.
  • Develop test plans and execute lab testing for thermal performance, pressure integrity, leak detection, and long-term reliability.
  • Lead the transition from prototypes to mass production by defining DFX requirements and managing EVT/DVT/PVT phases.
  • Perform failure analysis and drive corrective actions through FMEAs and other root cause investigation methods.
  • Support manufacturing process development including supplier qualification and the creation of leak/pressure test stations.

What we're looking for

  • BS/MS in Mechanical Engineering, Aerospace Engineering, or a related field is required (PhD preferred).
  • 5+ years of experience in thermal design and validation for high-power electronics.
  • Expertise in fluid dynamics, thermodynamics, and heat transfer first principles.
  • Proficiency in liquid cooling technologies including CFD, pressure drop/flow modeling, and thermal metrology.
  • Experience with lab instrumentation such as flow meters, pressure transducers, thermocouples, and test automation using Python or LabVIEW.
  • Experience managing products through EVT, DVT, and PVT stages, including DFX and supplier engagement.
  • Strong technical communication and documentation skills.

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