Principal Product Engineer, HPC Products

Arm Holdings

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Austin, TX
Salary
$249,900–$338,100 / yr
Posted
32 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $203k
This role $294k
$130k most similar roles pay here $360k

This role pays more than 91% of similar roles. Most pay $169,550–$236,850 — the shaded band above. At the midpoint, this role pays about $294k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Arm Holdings

Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.

Arm Holdings currently has 109 open roles on FindRole.

Listed pay typically runs $208,450–$282,050 across 108 roles with salary data.

Most-posted roles

View all roles at Arm Holdings

At a glance

TL;DR · Principal Product Engineer, HPC Products

As a Principal Product Engineer, HPC Products, you will lead the productization of next-generation high-performance compute silicon from pre-silicon readiness through bring-up, qualification, and production ramp. You will own cross-functional execution across silicon characterization, performance and power correlation, High-Speed I/O (HSIO), manufacturing test, yield, reliability, and advanced packaging. Your daily work involves defining productization requirements, leading first-silicon bring-up, and driving HSIO characterization for interfaces like PCIe, CXL, DDR, and Ethernet. You will manage manufacturing test strategies across wafer sort and system-level environments while ensuring quality and cost efficiency. The role requires expertise in silicon power, voltage, frequency, and temperature relationships, alongside proficiency in tools such as JMP or Silicon.da. This position solves complex technical challenges in the HPC domain, specifically focusing on high-core-count products, chiplet architectures, and advanced 2.5D/3D packaging technologies.

What does a Product Engineer earn?

Median $197500 from 35 postings across 8 companies.

See salary data

What you'll do

  • Manage end-to-end product engineering for HPC silicon from pre-silicon readiness through high-volume manufacturing.
  • Lead first-silicon bring-up and PVTF characterization including voltage, frequency, power, and thermal behavior.
  • Correlate pre-silicon models with silicon measurements to define product limits, binning, and operating points.
  • Execute HSIO productization and characterization for interfaces like PCIe, CXL, DDR, and Ethernet.
  • Develop manufacturing test and SLT strategies across wafer sort and final test environments.
  • Drive yield learning, reliability testing, and failure analysis in partnership with foundry and OSAT suppliers.
  • Support advanced 2.5D/3D and chiplet-based productization while establishing data-driven health metrics.
  • Provide technical leadership to cross-functional teams and mentor engineers on product engineering methodologies.

What we're looking for

  • Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • Typically 12+ years of semiconductor industry experience.
  • Experience bringing multiple complex CPU, GPU, accelerator, or SoC products from pre-silicon through production/HVM.
  • Deep knowledge of silicon power, performance, voltage, frequency, and temperature relationships including PVTF and design-to-silicon correlation.
  • Strong understanding of manufacturing flow, DFT/DFX, wafer sort, final test, SLT, qualification, binning, fusing, and yield optimization.
  • Working knowledge of HSIO productization, characterization, and debug for interfaces like PCIe, CXL, DDR, or Ethernet.
  • Ability to analyze large silicon datasets using tools such as JMP, Silicon.da, Optimal+, or equivalent (preferred).
  • Experience with HPC, server-class CPUs, GPUs, AI/ML accelerators, 2.5D/3DIC, and advanced packaging (preferred).

More like this

Similar roles

Senior Principal Product Engineer

Arm Holdings

Austin, TX 73 days ago $308,600–$417,500
ATE SLT SoC Silicon Characterization Yield Improvement BIST Scan Mixed-Signal Design Device Physics 2.5D/3DIC Sub-3nm Nodes NPI HVM PVTF Electrical Failure Analysis Fusing Bare Metal
10+ yrs exp

Principal Product Engineer

Microsoft

10 days ago $142,800–$274,800
Semiconductor IC ATE DFT DFM Silicon Fabrication Yield Analysis Device Physics Failure Analysis Characterization RVP SoC CPU
8+ yrs exp Hybrid

Product Development Engineer

Amd

Austin, TX 47 days ago $130,400–$195,600
ATE Advantest V93K DFT Silicon Bring-up Characterization Python Git Linux Unix Windows PCIe USB DDR JTAG I2C I3C GPIO PLLs Automation AI/ML
Hybrid

Server Postsilicon Project Engineer

Qualcomm

Santa Clara, CA 18 days ago $243,200–$364,800
Silicon SoC CPU PCIe CXL Memory Systems ATE SLT Post-Silicon Validation Characterization Issue Triage data-center Hardware Engineering Systems Engineering
8+ yrs exp

Principal Product Software Engineer

The Walt Disney Company

Remote 27 days ago $206,400–$276,700
Java Scala SQL NoSQL CI/CD Source Control Data Structures Algorithms Messaging Technologies
10+ yrs exp Remote