Principal Engineer, PCB/Package Co-design
Arm Holdings
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How this pay compares to similar roles
This role pays more than 97% of similar roles. Most pay $160,581–$237,800 — the shaded band above. At the midpoint, this role pays about $294k versus about $199k for comparable roles.
Based on 240 similar postings.
Employer
Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.
Arm Holdings currently has 50 open roles on FindRole.
Listed pay typically runs $209,100–$282,900 across 50 roles with salary data.
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At a glance
As a Principal Engineer - PCB/Package Co-design, you will join the Packaging, Boards and Multiphysics team to develop physical hardware development platforms based around custom Arm SoC. You will collaborate with global engineering groups to define technical requirements, evaluate design trade-offs, and integrate silicon packaging with PCB designs. Your daily work involves brainstorming breakout strategies, routing, and layer optimization while ensuring signal and power integrity for high-performance embedded compute, Cloud/Edge AI, and IoT systems. You will utilize Cadence OrCAD and Allegro tools to manage schematic entry and layout. Key technical requirements include experience with high-speed IO standards like PCIe Gen5/6/7 and LPDDR5/6, as well as expertise in HDI fabrication processes and escape routing analysis for high-density SoCs. You will bridge the gap between silicon packaging and board design to optimize cost, performance, and manufacturability.
What does a Engineer earn?
Median $180500 from 267 postings across 57 companies.
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