Principal Engineer - Board/Package Co-design
Arm Holdings
Quick summary
Market check
How this pay compares to similar roles
This role pays more than 91% of similar roles. Most pay $181,010–$242,847 — the shaded band above. At the midpoint, this role pays about $294k versus about $212k for comparable roles.
Based on 240 similar postings.
Employer
Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.
Arm Holdings currently has 105 open roles on FindRole.
Listed pay typically runs $209,100–$282,900 across 105 roles with salary data.
Most-posted roles
At a glance
As a Principal Engineer - Board/Package Co-design, you will join the Packaging, Boards and Multiphysics team to develop physical hardware development platforms based around custom Arm SoC. You will collaborate with global engineering groups to define technical requirements, evaluate design trade-offs, and integrate PCB and silicon packaging solutions. Your daily work involves brainstorming breakout strategies, routing, and layer optimization while translating technology requirements into platform architectures. You will manage signal and power integrity analysis, assess manufacturability of advanced PCB technologies, and evaluate package pinout options against cost and routability. The role requires expertise in high-speed IO standards like PCIe and LPDDR, experience with complex LSI devices, and proficiency in Cadence OrCAD and Allegro tools. You will solve critical integration challenges for embedded compute systems across the Cloud, Edge AI, and IoT domains.
What does a Engineer earn?
Median $185000 from 207 postings across 51 companies.
Skills
What you'll do
What we're looking for
More like this
Arm Holdings
Arm Holdings
Arm Holdings
Arm Holdings
Amd
Baker Hughes