Physical Design Engineer

Broadcom

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Quick summary

Work type
On-site
Location
San Jose, CA
Employment
Full-time
Posted
64 days ago
Freshness
Confirmed live today
Closes
Feb 20, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $198k
$140k $245k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $167,100–$229,575.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · Physical Design Engineer

The Physical Design Engineer joins the ASIC Products Division to develop next-generation products with a focus on parallel interfaces. This role involves the design implementation and physical layout of power grids, 2.5D and 3D die-die interconnects, and high-speed signal interconnects. Key responsibilities include performing DRC, LVS, and electrical checking, automating common design processes, and conducting electrical analysis for ubump and RDL patterns. The engineer will also evaluate new interconnect technologies and manage technology and testchip roadmapping for advanced packaging. Required skills include experience with IC, Package, and PCB layout databases and tools, along with strong TCL and Python scripting for automation. The work addresses complex technical problems in 3D and 2.5D interconnects for machine learning, cloud computing, wireless infrastructure, and networking.

What does a Physical Design Engineer earn?

Median $177300 from 31 postings across 9 companies.

See salary data

What you'll do

  • Design and implement physical layouts for power grids and 2.5D/3D die-die interconnects.
  • Perform DRC, LVS, and electrical checking on designs.
  • Automate common design processes and routine tasks using TCL and Python scripting.
  • Develop high-speed signal interconnects in coordination with SI and PI engineers.
  • Perform electrical analysis and optimization of ubump and RDL patterns.
  • Evaluate and develop new 2.5D and 3D interconnect technologies.
  • Create technology and testchip roadmaps with a focus on advanced packaging.

What we're looking for

  • Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience.
  • Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.
  • Experience with various IC, Package, and PCB layout databases and tools.
  • Strong TCL and Python scripting experience to automate routine tasks.
  • Experience with physical layout implementation of power grids and 2.5D/3D die-die interconnects.
  • Ability to perform DRC, LVS, and electrical checking.
  • Ability to develop high-speed signal interconnects alongside SI and PI engineers.
  • Ability to manage multiple concurrent customers under short timelines.

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