IC Packaging Integration Engineer

Apple Inc

Confirmed live today High trust

Quick summary

Work type: On-site
Location: —
Salary: $184,700–$324,800 / yr
Posted: 134 days ago
Freshness: Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $198k

This role $255k

$129k most similar roles pay here $346k

This role pays more than 97% of similar roles. Most pay $158,450–$238,450 — the shaded band above. At the midpoint, this role pays about $255k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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At a glance

TL;DR · IC Packaging Integration Engineer

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The IC Packaging Integration Engineer joins the hardware team to lead SoC package integration and architecture efforts while driving advanced package solutions, new material developments, and specifications. This role involves collaborating with cross-functional teams to deliver optimized solutions meeting electrical, mechanical, and thermal requirements. The engineer will manage test vehicle definition and execution with foundries and OSATs for technologies including FOWLP, 2.5D, 3D, and coreless MCM. Key responsibilities include leading failure analysis, root cause investigations, and utilizing DOE principles and statistical analyses to establish robust build plans. The role requires expertise in signal integrity, power integrity, and Allegro for reviewing schematics and layouts. Additionally, the candidate will apply AI/ML and data analytics to convert complex foundry datasets into actionable insights for process optimization and yield improvement within the semiconductor packaging domain.