Integrated Circuit Packaging Architect Engineer

What you'll do

• Define package architectures and roadmaps with product architects during early definition stages.
• Lead new package technology development initiatives from initial concept to full qualification.
• Drive test vehicle design and manufacturing to establish design rules and DFM/DFY guidelines.
• Establish a yield roadmap and lead the implementation of yield and data analytic tools.
• Lead cross-functional teams across different geographies to design novel package architectures and processes.
• Communicate technology development progress and technical problem-solving to executive leadership.
• Engage with worldwide ecosystem partners to gather data and identify technical solutions.

What we're looking for

• BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering, or equivalent.
• Proven track record of driving technology development in the semiconductor field.
• Leadership experience driving engineering teams in architecture definition, process definition, and/or yield improvement.
• Excellent oral and written communication skills to share complex signals and recommendations with partners and management.
• Experience in semiconductor technology development (preferred).
• Experience working with manufacturing partners such as suppliers, OSATs, and foundry partners (preferred).
• In-depth knowledge in material science, thin film process development, and/or packaging (preferred).
• Experience in a leadership role driving cross-functional teams (preferred).