IC Packaging Simulation Engineer
Apple Inc
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This listing doesn't post a salary. Most similar roles pay $161,965–$216,250.
Based on 240 similar postings.
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Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has 1984 open roles on FindRole.
Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.
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The IC Packaging Simulation Engineer joins a multifaceted collaborative organization to perform numerical modeling of stress and deformation for component packages. This role focuses on understanding chip-package and package-board interactions to ensure high device yield and reliability throughout the product development and manufacturing stages. The engineer will actively explore feasibility during product definition, identify risks, and support new product introduction by solving emerging problems. Key responsibilities include programming or scripting CAD and FEM software, as well as utilizing Generative-AI, Machine Learning, and numerical tools to create automated model-generation user interfaces. Candidates should possess expertise in mechanics, mathematics, and materials behavior. Required technical skills include proficiency with ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python to solve complex problems related to electronic packaging structures and reliability requirements within the semiconductor domain.
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