IC Packaging Simulation Engineer

Apple Inc

Quick summary

Work type
On-site
Location
Austin, TX
Posted
45 days ago

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How this pay compares to similar roles

Similar $179k
$126k most similar roles pay here $228k

This listing doesn't post a salary. Most similar roles pay $152,875–$205,000.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 638 open roles on FindRole.

Listed pay typically runs $171,600–$272,100 across 505 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

We are seeking a self-motivated IC Packaging Simulation Engineer to join our dynamic hardware engineering team. In this role, you will conduct stress and deformation simulations of integrated circuit packages using ANSYS or ABAQUS to ensure device yield and reliability. You will also develop automated model-generation user interfaces by scripting CAD/FEM software and integrating generative AI/ML tools. Responsibilities include identifying risks during product development through simulation analysis and supporting new product introductions by solving emerging manufacturing issues. Ideal candidates have hands-on experience with FEM tools, proficiency in MATLAB or Scientific Python, and a deep understanding of packaging materials and electronic structures. This role demands expertise in mechanics, mathematics, and numerical simulations to tackle complex challenges in the semiconductor industry.

What you'll do

  • Conduct stress and deformation simulations of IC packages to ensure device yield and reliability.
  • Identify risks in product package definition through simulation feasibility studies.
  • Develop automated model-generation interfaces using CAD/FEM software and scripting languages.
  • Support new product introduction by solving development and manufacturing problems.
  • Utilize generative AI, machine learning, and numerical tools for advanced simulations.

What we're looking for

  • Proven capability in mechanics and mathematics.
  • Hands-on experience with ANSYS or ABAQUS for FEM simulation.
  • Proficiency in scripting CAD/FEM software and setting up automated interfaces.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures, processes, reliability, and qualification requirements.

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