IC Packaging Simulation Engineer

Apple Inc

Confirmed live 2 days ago Trusted

Quick summary

Work type
On-site
Location
Austin, TX
Posted
143 days ago
Freshness
Confirmed live 2 days ago

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Salary context

How this pay compares to similar roles

Similar $189k
$141k most similar roles pay here $234k

This listing doesn't post a salary. Most similar roles pay $161,965–$216,250.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

The IC Packaging Simulation Engineer joins a multifaceted collaborative organization to perform numerical modeling of stress and deformation for component packages. This role focuses on understanding chip-package and package-board interactions to ensure high device yield and reliability throughout the product development and manufacturing stages. The engineer will actively explore feasibility during product definition, identify risks, and support new product introduction by solving emerging problems. Key responsibilities include programming or scripting CAD and FEM software, as well as utilizing Generative-AI, Machine Learning, and numerical tools to create automated model-generation user interfaces. Candidates should possess expertise in mechanics, mathematics, and materials behavior. Required technical skills include proficiency with ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python to solve complex problems related to electronic packaging structures and reliability requirements within the semiconductor domain.

What you'll do

  • Perform numerical modeling of stress and deformation for IC packages to ensure device yield and reliability.
  • Analyze chip-package and package-board interactions through detailed simulation studies.
  • Evaluate product package definitions to identify potential risks to reliability and manufacturing yield.
  • Provide technical support during New Product Introduction (NPI) to resolve issues in development and manufacturing.
  • Develop scripts for CAD/FEM software to automate model-generation user interfaces.
  • Integrate Generative AI, Machine Learning, and numerical tools into simulation workflows.
  • Maintain and update codebases used for automated modeling and simulation processes.

What we're looking for

  • Must have a bachelor's degree.
  • Proficiency in FEM simulation using software such as ANSYS or ABAQUS.
  • Expertise in MATLAB and/or Scientific Python.
  • Hands-on experience with Generative AI and Machine Learning tools.
  • Proven capability in mechanics and mathematics.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures, processes, and reliability requirements.
  • Ability to perform independent research and communicate complex concepts clearly.

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