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Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 528 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 507 roles with salary data.

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TL;DR · Director, IC Packaging Engineering, Mechanical Simulation

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The Director of Mechanical Simulation at Qualcomm Technologies leads a team within the IC Packaging organization, focusing on delivering FEA-based mechanical simulation solutions for current and next-generation chipsets. This senior role involves strategic alignment with design/architecture, NPI, assembly, and CPI teams to ensure high-quality support across HVM and advanced packaging programs. Responsibilities include developing and validating ANSYS APDL models, establishing best practices in test correlation and material characterization, and guiding stress analysis for IC package designs. The ideal candidate has extensive experience in Finite Element modeling for electronic packaging, a proven track record of building and scaling simulation teams, and deep expertise in materials science and thermo-mechanical behavior.

Skills

ANSYS APDL FEA IC packaging Solder Joint Reliability (SJR) Board Level Reliability (BLR) Chip-Package Interaction (CPI) Material characterization Automation frameworks APDL macros OptiSLang Scripting Thermo-mechanical behavior DOE Technical communication Cross-functional collaboration

What you'll do

Lead the development and validation of mechanical FEA models for IC packaging.
Establish best-known methods for test correlation and material characterization.
Guide stress/mechanical analysis for IC package designs across various simulations.
Drive strategic alignment with cross-functional teams to ensure high-quality support.
Champion innovation in simulation workflows, automation, and tooling methodologies.
Manage a team of engineers responsible for delivering FEA-based mechanical solutions.

What we're looking for

Bachelor's degree in relevant engineering field with 8+ years of experience or higher-level degrees with fewer years of experience.
Over 12 years of experience in Finite Element modeling and analysis for IC electronic packaging and interconnects.
At least 5 years of direct people management, including managing managers or senior technical staff.
Proven ability to build and scale high-performing simulation or engineering teams.
Deep expertise in IC electronic packaging structures, assembly processes, reliability testing, and DOE.
Experience establishing simulation BKMs, methodologies, and automation frameworks using tools like APDL macros and scripting pipelines.
Strong background in electronic packaging materials and their thermo-mechanical behavior.