This role pays more than
89%
of similar roles. Most pay
$170,000–$250,500
— the shaded band above.
At the midpoint, this role pays about
$284k
versus about
$210k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
621 open roles
on FindRole.
Listed pay typically runs
$147,900–$222,500
across 601 roles with salary data.
The Director, IC Packaging Engineering – Mechanical Simulation joins the Integrated Circuits Packaging organization as a senior leader within the Mechanical Simulation function. This individual will lead a team of engineers to deliver FEA-based mechanical simulation solutions for current and next-generation chipsets and advanced packaging technologies. Key responsibilities include driving strategic alignment across design, assembly, and Chip-Package Interaction teams while overseeing the development and validation of mechanical FEA models using ANSYS APDL. The role focuses on solving complex problems involving Warpage, Solder Joint Reliability, and Board Level Reliability through simulation workflows, automation, and material characterization. Required expertise includes finite element modeling, thermo-mechanical behavior analysis, and proficiency in tools like OptiSLang or scripting for automation pipelines. The position ensures high-quality mechanical support across High Volume Manufacturing programs by establishing best practices for test correlation and package design.