below marketmost similar roles pay hereabove market
This role pays less than
65%
of similar roles. Most pay
$221,810–$286,325
— the blue band above.
At the midpoint, this role pays about
$232k
versus about
$254k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
500 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 500 roles with salary data.
Director – Advanced Packaging (Panel-Scale Technologies) leads the panel-scale packaging technology for next-generation data center and AI accelerator products. This role involves setting the technology direction and managing external partners, including foundries, OSATs, substrate, materials, and equipment vendors. The position holder defines materials, processes, design rules, and Design for Manufacturing and Design for Yield guidelines. Key responsibilities include leading development for panel-level fan-out, large-format RDL, interposers, and die bonding from concept through high-volume manufacturing. The role requires expertise in 2.5D and 3D packaging, wafer-level assembly, and thermocompression bonding. Candidates must address thermo-mechanical, power delivery, and signal integrity challenges while managing cross-functional teams to resolve issues like warpage and dimensional stability for large-format substrates and high-power data center packages.
Define the panel-scale packaging technology roadmap for data center and AI products.
Lead partner technology development from concept through full qualification for panel-level fan-out and die bonding.
Set technical requirements for materials selection and process definitions to meet performance and cost targets.
Establish design rules and DFM/DFY guidelines with partners using jointly defined test vehicles.
Drive partner equipment and infrastructure readiness for panel-format manufacturing.
Resolve large-panel manufacturing challenges including warpage, dimensional stability, and large-area uniformity.
Monitor partner data to establish yield and reliability targets and drive joint improvement plans.
Provide executive-level updates on partner progress, risks, and technical decisions to AMD leadership.
What we're looking for
BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Applied Physics, Applied Mathematics, or equivalent.
Proven track record of driving semiconductor technology development through external partners, ideally in advanced packaging for data center products.
Experience leading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors (preferred).
Deep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates (preferred).
Experience in wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning (preferred).
Experience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding (preferred).
Familiarity with emerging panel technologies such as glass-core substrates and panel-level RDL and interposers (preferred).
Breadth of experience addressing thermo-mechanical, power delivery, and signal integrity challenges in large, high-power data center packages (preferred).