Applications Engineer, Semiconductor 3D X-ray Solutions

What you'll do

• Lead system demonstrations and technical presentations for semiconductor customers at fabs, labs, and R&D centers.
• Develop new applications and methodologies tailored to specific semiconductor devices, processes, and packaging technologies.
• Provide critical input to product development teams based on customer needs and identified application gaps.
• Deliver advanced training to customers on system operation, data acquisition, and analysis workflows.
• Design and optimize robust inspection and analysis workflows for semiconductor manufacturing and failure analysis.
• Perform tool characterization, benchmarking, and baseline performance studies for specific semiconductor use cases.
• Serve as a technical lead for customer-facing activities including trade shows and the authorship of technical papers.
• Solve high-value problems related to yield, reliability, process development, and advanced packaging.

What we're looking for

• BS or MS degree in a relevant technical field such as Materials Science, Physics, or Electrical Engineering.
• 3–5 years of experience in a semiconductor-related field including fabs, failure analysis, metrology, or process development.
• Hands-on experience designing experiments and analyzing data in a commercial or customer-facing environment.
• Ability and willingness to travel up to 30% domestically and internationally.
• Background in microscopy or advanced imaging techniques such as X-ray CT, SEM, or FIB.
• Working knowledge of X-ray absorption principles and imaging/optical fundamentals.
• Experience with semiconductor capital equipment for inspection, metrology, or failure analysis workflows.
• Familiarity with advanced semiconductor technologies including 3D IC, heterogeneous integration, and advanced packaging.