This role pays less than
90%
of similar roles. Most pay
$158,212–$223,500
— the shaded band above.
At the midpoint, this role pays about
$126k
versus about
$191k
for comparable roles.
Based on 240 similar postings.
Employer
About Samsung Electronics
Samsung Electronics is a South Korean multinational corporation and a global leader in technology, specializing in consumer electronics, semiconductors, and home appliances.
Samsung Electronics currently has
84 open roles
on FindRole.
Listed pay typically runs
$106,000–$200,250
across 78 roles with salary data.
C2C Bonding - BEOL Module Integration Engineer
As a C2C Bonding Expert, you will lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors. You will be responsible for owning module integration for bonding and farBEOL steps within the process flow while managing systematic yield and reliability issues. Your daily work involves leading projects to cure systematics, controlling critical dimension targeting and variation, and providing yield risk assessments and failure modeling during factory incidents. To succeed in this role, you must possess expertise in lithography, etch, diffusion, thin film deposition, wet cleans, and CMP processes. You will utilize your deep knowledge of the interactions between process flow, product performance, and reliability to drive innovations in hybrid bonding processes that enable stacked image sensors with superior yield, performance, and reliability for advanced semiconductor manufacturing.