Design Engineer - Chip Floorplanner

Broadcom

Quick summary

Work type
On-site
Location
Fort Collins, CO
Salary
$127,100–$203,400 / yr
Posted
25 days ago
Closes
Nov 6, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $186k
This role $165k
$116k most similar roles pay here $231k

This role pays less than 67% of similar roles. Most pay $155,275–$216,250 — the shaded band above. At the midpoint, this role pays about $165k versus about $186k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 61 open roles on FindRole.

Listed pay typically runs $120,000–$192,000 across 60 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · Design Engineer - Chip Floorplanner

Join Broadcom’s Custom Silicon Design Team as a Floorplanning Engineer, contributing to the development of cutting-edge AI, Cellular, Networking, Computing, and Storage ASICs. This role involves defining and optimizing chip-level physical architecture for high-performance SoCs operating at speeds exceeding 1 GHz, from concept through production. Day-to-day responsibilities include floorplan definition, macro placement, power grid design, and collaboration with RTL, timing, and packaging teams to balance performance, power, and area targets. Essential skills encompass VLSI design principles, TCL scripting, Linux environments, and proficiency in Python or similar languages. Familiarity with Cadence tools is a plus. This position requires strong communication and problem-solving abilities, as well as the capacity to mentor others and lead initiatives across global teams.

What you'll do

  • Define and optimize top-level floorplan architecture for advanced ASICs.
  • Drive macro placement, power grid design, and clock distribution planning.
  • Lead top-level timing closure and congestion analysis to ensure tapeout readiness.
  • Coordinate with block owners for smooth integration from block-level to top-level.
  • Apply deep understanding of physical verification and IR/EM analysis for signoff-quality results.
  • Contribute to the development of advanced process technology design methodologies.

What we're looking for

  • At least 10 years of experience in VLSI design or equivalent MS degree.
  • Expertise in floorplanning, die partitioning, hierarchical design, and PPA optimization.
  • Proficiency in TCL scripting and Linux environments; Python, Perl, Ruby preferred.
  • Experience with Cadence or similar physical design tools for advanced process nodes.
  • Strong collaboration skills and ability to work across global teams effectively.

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