CPU Core Physical Design Thermal Modeling Lead

What you'll do

• Ensure CPU Cores and SOC meet specific thermal requirements and silicon performance targets.
• Develop and align thermal modeling methodologies in collaboration with package modeling teams.
• Create new design and analysis methodologies to improve the product's thermal profile.
• Translate usage models and workload requirements into IP performance, power, and thermal constraints.
• Align technical requirements across cross-functional teams to meet critical project milestones.
• Manage end-to-end technical workstreams to resolve issues, risks, and dependencies.
• Automate flows and processes using scripting expertise.

What we're looking for

• Bachelor's or Master's degree in computer engineering or Electrical Engineering.
• Proven technical leadership to drive cross-functional alignment and execution across architecture, physical design, and package modeling teams.
• Experience ensuring CPU Cores and SOC meet thermal requirements and silicon performance.
• Strong Physical Design background with extensive EDA tool experience (preferred).
• Knowledge of physical design power and performance metrics in high-performance SoC/IP design (preferred).
• Familiarity with package models and advanced packaging designs (preferred).
• Experience collaborating with pre-silicon design and package modeling teams to align architecture assumptions (preferred).
• Expertise in scripting and flow automation (preferred).