CPU System and Compute Die Architect
Qualcomm
At a glance
AI generatedAs a CPU Power and Thermal Management Architect at Qualcomm Technologies, Inc., you will join a dedicated team focused on developing next-generation computing platforms by reimagining silicon for high-performance, low-power devices across various segments including datacenter servers, mobile, compute, and automotive SoCs. Your primary responsibilities include collaborating with architects and software teams to design the architecture and micro-architecture of power management systems, encompassing boot architecture, idle and active power management, clock management, and thermal limits. You will leverage extensive knowledge in CPU and SoC architecture, dynamic voltage and frequency scaling, and analog mixed signals IPs to optimize system performance while ensuring reliability. Key skills required include a deep understanding of software and firmware control loops, as well as the ability to develop comprehensive technical documentation for stakeholders.
Skills
What you'll do
What we're looking for
Market check
This $198,700–$298,100 range sits above 85% of similar postings on FindRole.
Peer median band
$154,700–$244,000
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$166,825–$235,750
Middle half of comparable postings.
Based on 240 comparable postings.
* 240 is the maximum number of comparable postings sampled.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 569 open roles on FindRole.
Listed pay typically runs $148,300–$224,400 across 536 roles with salary data.
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