CPU System and Compute Die Architect
Qualcomm
Quick summary
Market check
How this pay compares to similar roles
This role pays more than 78% of similar roles. Most pay $196,750–$256,950 — the blue band above. At the midpoint, this role pays about $262k versus about $227k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
Most-posted roles
At a glance
The CPU Power and Thermal Management Architect joins the CPU Engineering team to lead the micro-architecture and design of high-performance CPU systems. This role involves conceiving architectures for high-performance and low-power devices, specifically focusing on boot architecture, idle power management, active power management, clock management, and thermal limits. You will collaborate with software, firmware, and SoC architects to develop end-to-end system solutions, including dynamic voltage and frequency scaling, power gating techniques, and control loops for over-current and thermal limits. The position requires deep knowledge of microprocessor architecture, coherent CPU systems, and logic design principles. You will produce high-level specifications for RTL design and perform performance exploration. The work addresses critical power and thermal management challenges across Datacenter Server, Mobile, Compute, and Auto SoCs.
Skills
What you'll do
What we're looking for
More like this
Qualcomm
Amd
Apple Inc
Apple Inc
Apple Inc
Apple Inc