below marketmost similar roles pay hereabove market
This role pays less than
68%
of similar roles. Most pay
$167,700–$237,125
— the blue band above.
At the midpoint, this role pays about
$182k
versus about
$202k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
485 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 485 roles with salary data.
The Advanced Packaging Platform Lead — Yield & Data Analytics owns assembly and test yield for a portfolio of advanced packaging products from NPI through high-volume manufacturing. Working within the advanced packaging platform team, you will lead technical engagements with OSAT and foundry partners to set yield targets, drive corrective actions, and perform root cause analysis on yield issues. You will build and maintain root cause Paretos, publish weekly yield reports, and define data-readiness requirements for die-level traceability. The role requires expertise in 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge, or hybrid bonding. Technical requirements include proficiency in SQL, Python, Snowflake, and STDF. You will also mentor analysts and help shape AI-assisted analytics tools to solve complex manufacturing data challenges across client, server, and data center segments.
Own packaging yield for a portfolio of advanced packaging products from NPI through high-volume manufacturing.
Lead technical engagement with OSAT and foundry partners to set yield targets and drive corrective actions.
Drive root cause analysis on yield issues to provide actionable insights within one day.
Build and maintain root cause Paretos for each product and drive top contributors to closure.
Publish weekly yield reports and lead yield reviews with Business Unit and Product Engineering leadership.
Define data-readiness requirements for yield data feeds and die-level traceability with external partners.
Mentor analysts and help shape AI-assisted analytics tools used by the team.
What we're looking for
BS/MS/PhD in EE, ME, Materials, Chemical Eng. or related field.
Experience in semiconductor packaging, assembly, or test yield (preferred).
Hands-on yield ramp experience in advanced packaging such as 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge, or hybrid bonding (preferred).
Track record of driving OSAT and foundry partners to root cause and closure on yield issues (preferred).
Strong SQL and Python skills for working directly in large manufacturing data sets like Snowflake (preferred).
Experience with partner data systems including B2B feeds, STDF, and die-level traceability (preferred).
Experience across multiple product segments such as client, server, and data center (preferred).
Ability to use AI/agentic tools in engineering analysis (preferred).
Python
Tcl
SKILL
C++
PyTorch
TensorFlow
AI
ML
EDA
Cadence APD/SIP
Siemens Xpedition
Synopsys 3DIC/Compiler
DRC
LVS
2.5D
3D Packaging
Chiplets
Signal Integrity
Auto-routing