This listing doesn't post a salary. Most similar roles pay
$140,300–$204,437.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
120 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 107 roles with salary data.
As an Advanced Package Technology Engineer within the WW ASIC product development team, you will develop cost-effective, high-performance advanced custom package solutions that meet specific signal integrity, thermal, structural reliability, and assembly design rules. You will work closely with silicon and package design teams, marketing, NPI, and external suppliers to manage project schedules and support new design wins through volume ramps. Your role involves providing expertise in 2.5D and 3D technologies, engaging memory suppliers to define quality requirements, and managing programs with assembly partners. You will utilize CAD tools like APD, AutoCAD, and Solidworks for modeling and design optimization. The work focuses on solving complex technical challenges involving advanced multi-layer ceramic or organic substrates, interposers, and fine pitch flip chip packaging solutions while navigating the limits of cutting-edge 2.5D and 3D integration technologies.