Advanced Packaging Design Engineering Team Leader
Cisco
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How this pay compares to similar roles
This role pays more than 73% of similar roles. Most pay $173,432–$231,600 — the blue band above. At the midpoint, this role pays about $227k versus about $203k for comparable roles.
Based on 240 similar postings.
Employer
Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity
Cisco currently has 288 open roles on FindRole.
Listed pay typically runs $167,700–$245,200 across 225 roles with salary data.
Most-posted roles
At a glance
The Advanced Packaging Design Engineering Team Lead joins the Cisco Silicon One team to drive complex package design programs for high-performance Silicon ASICs. This role involves leading and mentoring engineers through the full development lifecycle from concept to tapeout, ensuring the delivery of scalable solutions for global networks. Key responsibilities include optimizing package pinouts, stack-ups, power distribution, and high-speed routing while collaborating with silicon floor planning, signal integrity, and power integrity teams. The position requires expertise in high-speed package design, power distribution networks, and industry-standard EDA tools for package layout. Candidates should possess experience with testing equipment like oscilloscopes and TDR/VNA analyzers, as well as scripting languages including Python, Perl, TCL, or shell programming to support advanced IC package design and heterogeneous system integration.
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