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Active Keyword: Process Engineer 3 Remove filter Clear all

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Process Engineer III

Lam Research

Austin, TX 2 days ago
Actively hiring Confirmed live 2 days ago Posted this week High trust
Plasma Physics Reactive Ion Etching (RIE) Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) PECVD Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) MATLAB Python Statistical Process Control (SPC) Design of Experiments (DOE) JMP Minitab Material Characterization Surface Engineering
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Software Engineering Manager, Credit Card Processing Systems

US Bank

Brookfield, WI +4 8 days ago $126,820–$149,200
Actively hiring Confirmed live yesterday High trust Below market
Microservices Java Spring Boot Kubernetes OpenShift AWS Azure GCP DevSecOps CI/CD SRE Mainframe Modernization API Design Event-driven Systems Containerization Agile Scrum SAFe
6+ yrs exp
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Process Engineer III

Lam Research

Tualatin, OR +1 11 days ago
Actively hiring Confirmed live yesterday High trust
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) MATLAB Python Statistical Process Control (SPC) Design of Experiments (DOE) JMP Minitab Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Material Characterization Surface Engineering
6+ yrs exp Hybrid
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Process Engineer III

Lam Research

Fremont, CA 16 days ago $86,000–$192,000
Actively hiring Confirmed live yesterday Trusted Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization Surface Engineering
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Process Engineer III

Lam Research

Tualatin, OR 17 days ago
Actively hiring Confirmed live yesterday Trusted
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization Surface Engineering
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Process Engineer III

Applied Materials

Santa Clara, CA 23 days ago $124,000–$171,000
Actively hiring Confirmed live 2 days ago High trust Competitive pay
CVD Semiconductor Manufacturing Process Engineering Hardware Characterization Technical Documentation
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Process Engineer III

Lam Research

Fremont, CA 31 days ago $86,000–$192,000
Actively hiring Confirmed live 2 days ago Trusted Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
Hybrid
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Process Engineer III

Lam Research

Tualatin, OR 32 days ago
Actively hiring Confirmed live 2 days ago Low trust
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Plasma Physics Material Characterization
5+ yrs exp
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Process Engineer III

Lam Research

Tualatin, OR 32 days ago
Actively hiring Confirmed live yesterday Low trust
ALD CVD PECVD PVD RIE ALE ICP CCP MATLAB Python JMP Minitab Statistical Process Control Design of Experiments Plasma Physics Material Characterization Surface Engineering
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Process Engineer III

Lam Research

Fremont, CA 36 days ago $86,000–$192,000
Actively hiring Confirmed live yesterday Trusted Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
Hybrid
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Process Engineer III

Lam Research

Fremont, CA 41 days ago $104,000–$192,000
Actively hiring Confirmed live 2 days ago Trusted Competitive pay
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics
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Process Engineer III

Lam Research

Fremont, CA 44 days ago $86,000–$192,000
Actively hiring Confirmed live yesterday Low trust Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
Hybrid
Save

Process Engineer III

Applied Materials

Santa Clara, CA 50 days ago $124,000–$171,000
Actively hiring Confirmed live yesterday High trust Competitive pay
CVD Semiconductor Manufacturing Process Engineering Hardware Characterization
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Process Engineer III

Lam Research

Tualatin, OR 51 days ago
Actively hiring Confirmed live yesterday Low trust
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics
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Process Engineer III

Lam Research

Tualatin, OR 52 days ago
Actively hiring Confirmed live 2 days ago Low trust
Wet Chemistry Electrochemistry Fluid Mechanics Surface Science Analytical Techniques SEMI Equipment Process Engineering Material Science Chemical Engineering
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Process Engineer III

Lam Research

Fremont, CA 57 days ago $86,000–$192,000
Actively hiring Confirmed live yesterday Low trust Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
Hybrid
Save

Process Engineer III

Lam Research

Albany, NY 60 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Material Characterization Surface Engineering
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Process Engineer III

Lam Research

Tualatin, OR 93 days ago
Actively hiring Confirmed live yesterday Low trust
Wet Chemistry Electrochemistry Fluid Mechanics Surface Science Analytical Techniques SEMI Equipment Process Engineering Material Science Chemical Engineering
Hybrid
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Process Engineer III

Lam Research

Tualatin, OR 99 days ago
Actively hiring Confirmed live yesterday Low trust
ALD CVD PECVD PVD RIE ALE ICP CCP MATLAB Python JMP Minitab SPC DOE Plasma Physics Material Characterization Surface Engineering
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Process Engineer III

Lam Research

Tualatin, OR 99 days ago
Actively hiring Confirmed live 2 days ago Low trust
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics
Save