Process Engineer III

Lam Research

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Tualatin, ORAlbany, NY
Posted
11 days ago
Freshness
Confirmed live yesterday
Closes
Feb 27, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $153k
$107k most similar roles pay here $201k

This listing doesn't post a salary. Most similar roles pay $129,575–$175,500.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 299 open roles on FindRole.

Listed pay typically runs $114,000–$253,000 across 141 roles with salary data.

Most-posted roles

View all roles at Lam Research

At a glance

TL;DR · Process Engineer III

Process Engineer 3 joins the Office of the CTO to drive innovation in semiconductor manufacturing. This role focuses on developing advanced process formulations, defining equipment hardware, and enhancing fabrication techniques to improve yields and reduce production costs. The engineer will conduct research, analyze test data to establish process specifications, and provide guidance to technicians while collaborating with customers to solve complex technical challenges. Key responsibilities include managing thin film deposition projects for sub 2nm node logic processes. Candidates should possess expertise in material science or chemical engineering, utilizing tools like MATLAB, Python, JMP, or Minitab. Preferred skills include experience with ALD, CVD, PECVD, PVD, and plasma physics. The role addresses critical challenges in the semiconductor roadmap by applying atomic precision and surface engineering to develop next-generation products for advanced logic nodes.

What does a Process Engineer earn?

Median $154500 from 30 postings across 6 companies.

See salary data

What you'll do

  • Conduct research, development, and evaluation of process engineering for semiconductor equipment and systems.
  • Develop and sustain new processes to reduce production costs and increase manufacturing yields.
  • Analyze test data to establish process specifications and determine next steps in development.
  • Manage thin film deposition projects including CVD, ALD, and plating for sub 2nm logic nodes.
  • Troubleshoot hardware and process problems in collaboration with customer engineers.
  • Provide leadership and technical guidance to process technicians during execution activities.
  • Present technical results and project updates to internal executives and external customers.

What we're looking for

  • A Master's degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field with 6+ years of experience is required.
  • A PhD with 3+ years of experience is required as an alternative to the Master's and experience requirement.
  • Experience in semiconductor manufacturing, process design, deposition, etch dielectrics, or metal films is preferred.
  • Familiarity with laboratory work, semiconductor equipment, surface preparation, and analytical techniques is preferred.
  • In-depth understanding of Statistical Process Control (SPC) and Design of Experiments (DOE) is preferred.
  • Proficiency in MATLAB, Python, or other scientific computing languages is preferred.
  • Knowledge of material synthesis, characterization, and plasma physics is preferred.
  • Experience with deposition technologies such as ALD, CVD, PECVD, or PVD is preferred.

More like this

Similar roles

Process Engineer III

Lam Research

Albany, NY 60 days ago
Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Material Characterization Surface Engineering

Process Engineer III

Lam Research

Tualatin, OR 51 days ago
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics

Process Engineer III

Lam Research

Tualatin, OR 99 days ago
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics

Process Engineer III

Lam Research

Austin, TX 2 days ago
Plasma Physics Reactive Ion Etching (RIE) Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) PECVD Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) MATLAB Python Statistical Process Control (SPC) Design of Experiments (DOE) JMP Minitab Material Characterization Surface Engineering

Process Engineer III

Lam Research

Tualatin, OR 17 days ago
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization Surface Engineering

Process Engineer III

Lam Research

Austin, TX 119 days ago
ALD CVD PECVD PVD RIE ALE ICP CCP MATLAB Python JMP Minitab SPC DOE Plasma Physics Material Characterization Surface Engineering