Wireless Module Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $166,600–$296,000 / yr
Posted: 1 day ago
Freshness: Confirmed live today
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $203k

This role $231k

$133k $313k

below market most similar roles pay here above market

This role pays more than 73% of similar roles. Most pay $165,000–$241,750 — the blue band above. At the midpoint, this role pays about $231k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3546 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2746 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture through mass-production ramp. This technical lead manages the full lifecycle of module integration, including RF design, packaging, product engineering, ATE, and reliability engineering. Key responsibilities include leading RF architecture discussions with Outsourced Semiconductor Assembly & Test partners, managing ATE hardware and software maturity, and performing yield analysis. The role requires executing schematics reviews, PCB layout assessments, and electromagnetic simulations while defining test coverage for VCO calibration, TX/RX power, and RF packet tests. Candidates must utilize skills in I2C and PCIe interfaces, data analysis for Cpk and retest rates, and DFM. The position solves complex manufacturing and reliability challenges for consumer electronic devices across multiple product lines.

Skills

RF Design ATE Yield Analysis Reliability Engineering PCB Layout DFM I2C PCIe EVM Test VCO Calibration TX/RX Power Calibration Data Analysis Cpk Firmware Product Engineering OSAT NPI

What you'll do

Lead wireless module development from early architecture definition through mass-production ramp.
Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations.
Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
Drive the formal module design release process for schematics, PCB layout, and RF simulations.
Lead failure analysis and implement improvements to enhance yield and retest rates.
Translate product field-usage profiles into data-driven reliability test models for modules and components.
Debug complex bring-up issues including I2C and PCIe interface problems during international travel.
Define and validate test coverage for RF packet, EVM, and sensitivity tests.

What we're looking for

BS degree and a minimum of 10 years of relevant industry experience.
Strong RF fundamentals.
Proven track record for effective written/verbal communication and leading projects with self-motivation.
2 or more years of wireless module development experience from early concept to mass production for consumer electronic devices (preferred).
Strong RF design background with experience in packaging, product engineering, ATE, and reliability engineering (preferred).
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
Experience managing vendor teams, leading cross-time-zone meetings, and setting up project schedules (preferred).
Ability to travel internationally (preferred).

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