Wireless Module Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: Sunnyvale, CA
Salary: $123,700–$218,000 / yr
Posted: 1 day ago
Freshness: Confirmed live today
Nearby: 99+ roles within 25 mi

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $202k

This role $171k

$110k $256k

below market most similar roles pay here above market

This role pays less than 65% of similar roles. Most pay $162,550–$241,750 — the blue band above. At the midpoint, this role pays about $171k versus about $202k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3515 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2718 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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JOB TITLE: Wireless Module Engineer The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture definition through mass-production ramp. This role serves as a technical lead, managing module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test facilities. Key responsibilities include leading RF architecture discussions, reviewing schematics and PCB layouts, and overseeing ATE hardware and software maturity. The engineer performs yield analysis, failure analysis, and reliability test modeling while ensuring compliance with internal specifications. Required skills include strong RF fundamentals, data analysis for Cpk and retest rates, and experience with I2C and PCIe interfaces. The role involves managing vendor teams to deliver tested modules for product NPI builds, ensuring technical excellence across multiple product lines through disciplined execution and cross-functional collaboration.

Skills

RF Design ATE Yield Analysis Reliability Engineering PCB Layout DFM I2C PCIe EVM Test VCO Calibration TX/RX Power Calibration RF Simulation Firmware Data Analysis AI ML OSAT NPI

What you'll do

Lead wireless module development from early architecture definition through mass-production ramp.
Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations.
Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
Drive the formal module design release process for schematics, PCB layout, and RF simulations.
Lead failure analysis and implement improvement activities to optimize yield and retest rates.
Translate product field-usage profiles into data-driven reliability test models for modules and components.
Debug hardware bring-up issues, including I2C and PCIe interface problems, during international travel.
Define test coverage for RF packet, EVM, and TX/RX power calibration tests.

What we're looking for

Bachelor's degree is required.
Strong RF fundamentals are required.
Proven track record for effective written/verbal communication and self-motivated project leadership is required.
2 or more years of wireless module development experience for consumer electronics (preferred).
Strong RF design background (preferred).
Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
Ability to travel internationally (preferred).