Wireless Module Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$166,600–$296,000 / yr
Posted
59 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $203k
This role $231k
$126k $314k
below market most similar roles pay here above market

This role pays more than 73% of similar roles. Most pay $165,000–$241,750 — the blue band above. At the midpoint, this role pays about $231k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3497 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2702 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

JOB TITLE: Wireless Module Engineer The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture through mass-production ramp. This role serves as a technical lead, managing module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test facilities. Key responsibilities include leading RF architecture discussions, reviewing schematics, PCB layouts, and electromagnetic simulations, and overseeing ATE hardware and software maturity. The engineer performs yield analysis, failure analysis, and reliability test modeling. Required skills include strong RF fundamentals, data analysis for Cpk and retest rates, and experience with I2C and PCIe interfaces. The role involves managing vendor teams to ensure modules meet quality requirements for consumer electronic devices, specifically focusing on TX/RX power calibration, VCO testing, and RF packet tests.

What you'll do

  • Lead wireless module development from early architecture definition through mass-production ramp.
  • Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations.
  • Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
  • Drive the formal module design release process for schematics, PCB layout, and RF simulations.
  • Validate and approve final ATE test coverage, limits, and hardware integration with OSAT partners.
  • Lead failure analysis and implement improvement activities to optimize yield and retest rates.
  • Translate product field-usage profiles into data-driven reliability test models for modules and components.
  • Debug complex bring-up issues including I2C and PCIe interface problems during international travel.

What we're looking for

  • BS degree and a minimum of 10 years of relevant industry experience.
  • Strong RF fundamentals.
  • Proven track record for effective written/verbal communication and self-motivated project leadership.
  • 2 or more years of wireless module development experience from early concept to mass production for consumer electronics (preferred).
  • Strong RF design background (preferred).
  • Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
  • Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
  • Ability to travel internationally (preferred).

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