Wireless Module Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $166,600–$296,000 / yr
Posted: 13 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $184k

This role $231k

$116k most similar roles pay here $315k

This role pays more than 83% of similar roles. Most pay $158,825–$208,850 — the shaded band above. At the midpoint, this role pays about $231k versus about $184k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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The Wireless Module Engineer serves as a technical lead within the Hardware Technology organization, driving wireless module development from early architecture definition through mass-production ramp. This role involves managing the full lifecycle of module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test sites. Key responsibilities include leading RF design discussions, overseeing PCB layout reviews, performing yield analysis, and coordinating with reliability engineering teams to develop data-driven test models. The candidate will manage hardware and software components such as load boards, daughter cards, and firmware calibrations while troubleshooting I2C and PCIe interface issues. Required expertise includes strong RF fundamentals, packaging, product engineering, and data analysis skills like CPK and retest rate analysis. The role focuses on solving complex manufacturing challenges to ensure high-quality wireless modules for various consumer electronic product lines.

Skills

RF Design ATE Yield Analysis PCB Layout DFM I2C PCIe Firmware EVM Test VCO Calibration Data Analysis AI ML Reliability Engineering NPI

What you'll do

Lead the development of wireless modules from early architecture definition through mass-production ramp.
Act as the primary technical liaison between internal cross-functional teams and outsourced manufacturing partners (OSAT).
Manage ATE hardware and software maturity, including load boards, firmware, and module calibrations at OSAT sites.
Drive the formal module design release process for schematics, PCB layout, and RF simulation results.
Oversee failure analysis and implement improvements to enhance yield and retest rates during production.
Collaborate with reliability engineering teams to develop data-driven test models based on field-usage profiles.
Travel internationally to perform hands-on bring-up of modules and ATE systems at manufacturing sites.

What we're looking for

Bachelor of Science degree required.
Minimum of 10 years of relevant industry experience.
Strong RF fundamentals and a strong RF design background.
Wireless module development experience from concept to mass production for consumer electronics.
Experience in packaging, product engineering, ATE, and reliability engineering is highly desirable.
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis.
Proven ability to manage vendor teams and lead cross-time-zone meetings.
Ability to travel internationally for manufacturing and test bring-up.