Wireless Module Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $118,000–$207,100 / yr
Posted: 1 day ago
Freshness: Confirmed live today
Nearby: 99+ roles within 25 mi

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $203k

This role $163k

$103k $257k

below market most similar roles pay here above market

This role pays less than 75% of similar roles. Most pay $163,835–$241,750 — the blue band above. At the midpoint, this role pays about $163k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3515 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2718 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture definition through mass-production ramp. This technical lead manages module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test sites, overseeing hardware components like load boards, sockets, and handlers alongside software, firmware, and module calibrations. Key responsibilities include leading RF architecture discussions, reviewing schematics, performing yield analysis, and managing failure analysis to optimize retest rates. The role requires expertise in RF design, packaging, product engineering, and reliability engineering to solve complex manufacturing and system integration problems. Candidates must utilize skills in data analysis, I2C, and PCIe interfaces to validate test coverage, including VCO calibration, TX/RX power testing, and EVM tests, ensuring technical excellence across multiple product lines.

Skills

RF Design ATE Yield Analysis Reliability Engineering DFM I2C PCIe EVM Test VCO Calibration TX/RX Power Calibration RF Packet Test Data Analysis Cpk GRR Firmware PCB Layout Schematics AI ML

What you'll do

Lead wireless module development from early architecture definition through mass-production ramp.
Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations at OSATs.
Drive the formal module design release process for schematics, PCB layout, and RF simulation results.
Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
Lead failure analysis and implement improvements to enhance yield and retest rates.
Translate product field-usage profiles into data-driven reliability test models for modules and components.
Travel internationally to perform module and ATE bring-up for new product builds.
Define and validate test coverage for RF packet, EVM, and sensitivity tests.

What we're looking for

Minimum requirement of a bachelor's degree.
Strong RF fundamentals.
Proven track record for effective written/verbal communication and leading projects with self-motivation.
2 or more years of wireless module development experience from early concept to MP for consumer electronic devices (preferred).
Strong RF design background (preferred).
Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
Experience in managing vendor teams and leading cross-time-zone meetings (preferred).