Wireless Module Engineer

Apple Inc

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Quick summary

Work type
On-site
Location
Sunnyvale, CA
Salary
$175,500–$311,700 / yr
Posted
1 day ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $203k
This role $244k
$131k $331k
below market most similar roles pay here above market

This role pays more than 87% of similar roles. Most pay $165,000–$241,750 — the blue band above. At the midpoint, this role pays about $244k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3546 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2746 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture through mass-production ramp. This technical lead manages the full lifecycle of module integration, overseeing RF design, packaging, product engineering, ATE, and reliability engineering. Key responsibilities include leading RF architecture discussions with Outsourced Semiconductor Assembly & Test partners, managing ATE hardware and software maturity, and performing yield analysis. The role requires executing schematics, PCB layouts, and electromagnetic simulations while defining test coverage for VCO calibration, TX/RX power, and EVM tests. Candidates must possess strong RF fundamentals and experience with I2C and PCIe interfaces. The position involves translating field-usage profiles into reliability test models and debugging complex bring-up issues to ensure high-quality production for multiple product lines.

What you'll do

  • Lead wireless module development from early architecture definition through mass-production ramp.
  • Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations.
  • Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
  • Drive the formal module design release process for schematics, PCB layout, and RF simulations.
  • Lead failure analysis and implement improvements to enhance yield and retest rates.
  • Translate product field-usage profiles into data-driven reliability test models for modules and components.
  • Travel internationally to lead module and ATE bring-up for new product builds.
  • Define and validate test coverage for RF packet, EVM, and sensitivity tests.

What we're looking for

  • BS degree and a minimum of 10 years of relevant industry experience.
  • Strong RF fundamentals.
  • Proven track record for effective written/verbal communication and leading projects with self-motivation.
  • 2 or more years of wireless module development experience from early concept to MP for consumer electronic devices (preferred).
  • Strong RF design background (preferred).
  • Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
  • Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
  • Ability to travel internationally (preferred).

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