Wireless Module Engineer

Apple Inc

Confirmed live yesterday Trusted

Quick summary

Work type: On-site
Location: Austin, TX
Posted: 59 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

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Similar $203k

$133k $253k

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3497 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2702 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture definition through mass-production ramp. This technical lead manages module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test facilities, overseeing hardware components like load boards, sockets, and handlers alongside software, firmware, and module calibrations. Key responsibilities include leading RF architecture discussions, reviewing schematics, PCB layouts, and electromagnetic simulations, and performing yield analysis using Cpk and retest rate data. The role requires expertise in RF design, packaging, product engineering, and reliability engineering to solve complex manufacturing and system integration problems. Candidates must utilize skills in I2C and PCIe interfaces, perform EVM and RX sensitivity tests, and collaborate with cross-functional teams to ensure technical excellence across multiple product lines.

Skills

RF Design ATE Yield Analysis Reliability Engineering PCB Layout DFM I2C PCIe EVM Test VCO Calibration TX/RX Power Calibration Data Analysis AI/ML Firmware Schematics

What you'll do

Lead wireless module development from early architecture definition through mass-production ramp.
Manage OSAT relationships to ensure compliance with internal specifications, procedures, and approval workflows.
Drive the formal module design release process for schematics, PCB layout, and RF simulation results.
Oversee ATE hardware and software maturity, including load boards, sockets, firmware, and module calibrations.
Validate and approve ATE test coverage, limits, and hardware integration for product NPI builds.
Lead failure analysis with OSATs to improve yield, retest rates, and test time optimization.
Translate product field-usage profiles into data-driven reliability test models for modules and components.
Debug hardware bring-up issues, including I2C and PCIe interface problems, during international travel.

What we're looking for

BS degree and a minimum of 10 years of relevant industry experience.
Strong RF fundamentals.
Proven track record for effective written/verbal communication and leading projects with self-motivation.
2 or more years of wireless module development experience from early concept to mass production for consumer electronic devices (preferred).
Strong RF design background (preferred).
Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
Ability to travel internationally (preferred).

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