Wireless Module Engineer

Apple Inc

Confirmed live yesterday Trusted

Quick summary

Work type: On-site
Location: Austin, TX
Posted: 13 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

Market check

Salary context

How this pay compares to similar roles

Similar $185k

$125k most similar roles pay here $230k

This listing doesn't post a salary. Most similar roles pay $158,825–$211,675.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

Most-posted roles

View all roles at Apple Inc

At a glance

TL;DR · Wireless Module Engineer

Role Posting Log in to save

The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture definition through mass-production ramp. This role serves as a technical lead and primary liaison between internal cross-functional teams and Outsourced Semiconductor Assembly & Test partners. You will manage module integration, ATE hardware and software maturity, and failure analysis while overseeing test coverage for components like VCO calibration, TX/RX power, and RF packet tests. The position requires deep expertise in RF design, packaging, product engineering, yield analysis, and reliability engineering to ensure high-quality manufacturing results. Key technical skills include proficiency in I2C and PCIe interfaces, data analysis for CPK and retest rates, and experience with DFM. You will navigate complex technical domains including electromagnetic simulation and system integration to solve critical hardware challenges across multiple product lines.

Skills

RF Design ATE Yield Analysis PCB Layout DFM I2C PCIe Firmware Data Analysis CPK EVM Test Reliability Engineering OSAT NPI AI ML

What you'll do

Lead the development of wireless modules from early architecture definition through mass production ramp.
Act as the primary technical liaison between internal engineering teams and outsourced manufacturing partners (OSAT).
Manage ATE hardware and software maturity, including load boards, daughter cards, and module calibrations.
Drive the formal design release process for schematics, PCB layouts, and RF simulation results.
Oversee failure analysis with OSATs to improve yield rates and optimize test times.
Translate product field-usage profiles into data-driven reliability test models for modules and components.
Define and validate test coverage including VCO calibration, TX/RX power, and RF packet tests.
Travel internationally to perform hands-on bring-up of hardware and debug interface issues like I2C and PCIe.

What we're looking for

Bachelor of Science degree required.
Minimum of 10 years of relevant industry experience.
Strong RF fundamentals and a strong RF design background.
Wireless module development experience from concept to mass production for consumer electronics.
Experience in packaging, product engineering, ATE, and reliability engineering is highly desirable.
Strong data analysis skills including yield analysis (Cpk) and retest rate analysis.
Proven track record of effective written and verbal communication and project leadership.
Ability to travel internationally.