Wireless Module Engineer

Apple Inc

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Work type
On-site
Location
Austin, TX
Posted
1 day ago
Freshness
Confirmed live today

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Similar $203k
$136k $253k
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This listing doesn't post a salary. Most similar roles pay $163,835–$241,750.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3515 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2718 roles with salary data.

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TL;DR · Wireless Module Engineer

The Wireless Module Engineer joins the Hardware Technology organization to drive wireless module development from early architecture definition through mass-production ramp. This technical lead manages module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test facilities. Key responsibilities include leading RF architecture discussions, reviewing schematics, PCB layouts, and electromagnetic simulations, and overseeing ATE maturity for hardware and software. The role requires managing load boards, daughter cards, and firmware calibrations while performing yield analysis, including CPK and retest rate analysis. Candidates must possess strong RF fundamentals and experience in packaging, product engineering, and reliability engineering. The position involves debugging I2C and PCIe interface issues, defining test coverage for TX/RX power and EVM tests, and collaborating with reliability teams to translate field-usage profiles into data-driven test models.

What you'll do

  • Lead wireless module development from early architecture definition through mass-production ramp.
  • Manage ATE hardware and software maturity, including load boards, sockets, and firmware calibrations.
  • Oversee OSAT compliance with internal specifications, review procedures, and approval workflows.
  • Drive the formal module design release process for schematics, PCB layout, and RF simulations.
  • Lead failure analysis with OSATs to improve yield, retest rates, and test time.
  • Translate product field-usage profiles into data-driven reliability test models for modules and components.
  • Travel internationally to perform module and ATE bring-up at OSAT facilities.
  • Define and validate test coverage for RF packet, EVM, and sensitivity tests.

What we're looking for

  • Strong RF fundamentals.
  • Proven track record for effective written/verbal communication and leading projects with self-motivation.
  • 2 or more years of wireless module development experience from early concept to MP for consumer electronic devices (preferred).
  • Strong RF design background (preferred).
  • Experience in packaging, product engineering, ATE, and reliability engineering (preferred).
  • Strong data analysis skills including yield analysis (Cpk) and retest rate analysis (preferred).
  • Ability to travel internationally (preferred).
  • Bachelors degree.

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