below marketmost similar roles pay hereabove market
This role pays less than
66%
of similar roles. Most pay
$152,000–$231,737
— the blue band above.
At the midpoint, this role pays about
$168k
versus about
$192k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
3499 open roles
on FindRole.
Listed pay typically runs
$166,600–$277,600
across 2707 roles with salary data.
The Substrate Technologist joins the Hardware Technology Packaging team to own and drive sophisticated package selection and new-generation product package structure and configuration optimization. This role involves leading RFSIP package substrate development, pathfinding technology, and roadmap definition while working with the substrate manufacturing industry, foundries, and OSAT to bring solutions from concept to high-volume manufacturing. The position requires defining and optimizing new package substrate architectures based on performance, technical risk, cost, and availability. Key technical skills include knowledge of Cu plating, lithography, dielectric materials, laser via formation, and solder resist. Candidates should possess experience with the Cadence Allegro platform and design for manufacturing. The work focuses on developing electronic packaging solutions for internal and custom external components of consumer electronic products.