Substrate Technologist

Apple Inc

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Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$122,700–$214,300 / yr
Posted
1 day ago
Freshness
Confirmed live today

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $192k
This role $168k
$108k $258k
below market most similar roles pay here above market

This role pays less than 66% of similar roles. Most pay $152,150–$231,737 — the blue band above. At the midpoint, this role pays about $168k versus about $192k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3499 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2707 roles with salary data.

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At a glance

TL;DR · Substrate Technologist

The Substrate Technologist joins the Hardware Technology Packaging team to own and drive sophisticated package selection and new-generation product package structure and configuration optimization. This role involves leading RFSIP package substrate development, pathfinding technology, and roadmap definition while working with the substrate manufacturing industry, foundries, and OSAT to move solutions from concept to high-volume manufacturing. Key responsibilities include defining and optimizing new package substrate architectures based on performance, technical risk, cost, and availability. The position requires expertise in substrate technology, manufacturing processes, design rules, and materials including Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist. Candidates should possess skills in Cadence Allegro platform tools and design review for manufacturing to solve technical issues during the full product development cycle.

What you'll do

  • Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
  • Develop new substrate technologies from concept to high-volume manufacturing with industry partners.
  • Define and optimize new package substrate architectures based on performance, risk, cost, and availability.
  • Drive the development of new materials and specifications for sophisticated package solutions.
  • Solve technical issues occurring during the full product development cycle.
  • Manage the design, manufacturing, and reliability of Apple package substrates.
  • Execute design for manufacturing (DFM) reviews using Cadence Allegro platform tools.

What we're looking for

  • Bachelor's degree required.
  • MS or Ph.D. and relevant industry experience (preferred).
  • Proven fundamentals in the material, chemistry, or mechanical engineering field(s) (preferred).
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap (preferred).
  • Hands-on experience in substrate manufacturing and technology development including Cu plating, Lithography, and Laser via formation (preferred).
  • Familiarity with package assembly and integration process (preferred).
  • Experience in Cadence Allegro platform tools and design review for manufacturing (preferred).
  • Exceptional technology development, project management, communication, and collaborative skills (preferred).

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