This role pays more than
75%
of similar roles. Most pay
$165,000–$225,800
— the shaded band above.
At the midpoint, this role pays about
$226k
versus about
$195k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
623 open roles
on FindRole.
Listed pay typically runs
$148,300–$222,500
across 603 roles with salary data.
Sr Staff or Principal Thermal Engineer, Server Packaging joins the Data Center team to develop high-performance, energy-efficient server solutions. The role involves developing thermal solutions for server products at both package and system levels to resolve complex management challenges. Key responsibilities include leading thermal architecture through simulation and testing, performing CFD simulations from silicon die to ambient, and creating custom software solutions to automate modeling and testing. The candidate will utilize tools such as ANSYS-Icepak and Celsius EC, while leveraging programming languages like Python, C/C++, or MATLAB for data analysis. Required expertise includes thermal management components like TIMs, spreaders, heat sinks, vapor chambers, and heat pipes. The role addresses the technical challenge of cooling high-performance servers through rigorous simulation, laboratory testing with airflow and temperature measurement equipment, and cross-functional design reviews.