Masters ASIC Package Engineering Co-op/Intern
Amd
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How this pay compares to similar roles
This role pays less than 80% of similar roles. Most pay $126,623–$216,250 — the shaded band above. At the midpoint, this role pays about $104k versus about $171k for comparable roles.
Based on 240 similar postings.
Employer
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has 511 open roles on FindRole.
Listed pay typically runs $166,400–$249,600 across 511 roles with salary data.
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At a glance
Spring/Summer 2027 Masters Photonics Design Engineering Co-Op serves as a critical role within the photonics design team to support next-generation computing applications. The individual will assist in the design, simulation, and evaluation of photonic integrated circuits and optical subsystems while developing automated workflows for testing and data analysis. Day-to-day responsibilities include performing device simulations, analyzing measurement data against predictions, and collaborating with packaging and systems engineers to solve complex technical challenges. Candidates should possess skills in Python, MATLAB, and engineering modeling techniques. The role requires knowledge of photonic device characterization and optical communication systems. Preferred expertise includes experience with tools like Ansys Lumerical, Luceda IPKISS, or Cadence Virtuoso, as well as familiarity with hardware such as vector network analyzers and tunable lasers to characterize semiconductor devices and integrated optics.
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